Multiple voltage-supplies in TSV-based three-dimensional (3D) power distribution networks

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2012, Pages 1819-1825

  Xu, Zheng ^a,b   Gu, Xiaoxiong ^c   Scheuermann, Michael ^c   Rose, Kenneth ^a   Webb, Buckwell C ^c   Knickerbocker, John U ^c   Lu, Jian Qiang ^a  

^a RENSSELAER POLYTECHNIC INSTITUTE   (United States)

^b IBM MICROELECTRONICS   (United States)

^c IBM T J WATSON RESEARCH CENTER   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

3D SYSTEMS; ELECTRICAL COUPLING; HETEROGENEOUS SYSTEMS; HYBRID APPROACH; MIXED SIGNAL; MULTIPLE POWER SUPPLY; PARASITICS; PHYSICAL ELEMENTS; POWER DELIVERY NETWORK; POWER DISTRIBUTION NETWORK; POWER NOISE; POWER SUPPLY; SPICE SIMULATIONS; SYSTEM LEVELS; THROUGH-SILICON-VIA; VOLTAGE LEVELS; VOLTAGE LOSS;

COMPUTER SIMULATION; ELECTRIC NETWORK ANALYSIS; ELECTRIC POWER TRANSMISSION;

THREE DIMENSIONAL COMPUTER GRAPHICS;

EID: 84866842349     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ECTC.2012.6249085     Document Type: Conference Paper

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