-
1
-
-
34250339940
-
Technologies for 3D assembly and chip level stack,
-
Seoul, Korea, Sep. 24-25
-
M. Bonkohara, "Technologies for 3D assembly and chip level stack, " in Proc. 2nd Int. Symp. Microelectron. Packag., (ISMP2003, IMAPS-Korea), Seoul, Korea, Sep. 24-25, 2003, pp. 85-90.
-
(2003)
Proc. 2nd Int. Symp. Microelectron. Packag., (ISMP2003, IMAPS-Korea)
, pp. 85-90
-
-
Bonkohara, M.1
-
2
-
-
84888478727
-
3D IC technology: Capabilities and applications
-
Burlingame, CA, Jun. 13-15
-
K. Guarini et al., "3D IC technology: Capabilities and applications," in Proc. 3D Architect. Semiconduct. Integr. Packag., Burlingame, CA, Jun. 13-15, 2004.
-
(2004)
Proc. 3D Architect. Semiconduct. Integr. Packag
-
-
Guarini, K.1
-
3
-
-
84888511998
-
3D integration of CMOS transistors with ICV-SLID technology
-
Burlingame, CA, Jun. 13-15
-
A. Klump et al., "3D integration of CMOS transistors with ICV-SLID technology," in Proc. 3D Architect. Semiconduct. Integr. Packag., Burlingame, CA, Jun. 13-15, 2005.
-
(2005)
Proc. 3D Architect. Semiconduct. Integr. Packag
-
-
Klump, A.1
-
4
-
-
24644439334
-
Wafer bonding of damascene-patterned metal/adhesive redistribution layers for via-first three-dimensional (3D) interconnect
-
J. J. McMahon, J.-Q. Lu, and R. J. Gutmann, "Wafer bonding of damascene-patterned metal/adhesive redistribution layers for via-first three-dimensional (3D) interconnect," in Proc. IEEE 55th Electron. Compon. Technol. Conf., 2005, pp. 331-336.
-
(2005)
Proc. IEEE 55th Electron. Compon. Technol. Conf
, pp. 331-336
-
-
McMahon, J.J.1
Lu, J.-Q.2
Gutmann, R.J.3
-
5
-
-
35348862384
-
A 3D stacked memory integrated on a logic device using SMAFTI technology
-
Y. Kurita et al., "A 3D stacked memory integrated on a logic device using SMAFTI technology," in Proc. IEEE 57th Electron. Compon. Technol. Conf., 2007, pp. 821-829.
-
(2007)
Proc. IEEE 57th Electron. Compon. Technol. Conf
, pp. 821-829
-
-
Kurita, Y.1
-
6
-
-
35348876001
-
Via first technology development based on high aspect ratio trenches filled with doped polysilicon
-
D. Henri et al., "Via first technology development based on high aspect ratio trenches filled with doped polysilicon," in Proc. IEEE 57th Electron. Compon. Technol. Conf., 2007, pp. 830-835.
-
(2007)
Proc. IEEE 57th Electron. Compon. Technol. Conf
, pp. 830-835
-
-
Henri, D.1
-
7
-
-
35348819915
-
Sloped through wafer vias for 3D wafer level packaging
-
Reno, NV, May 29-Jun. 1
-
D. S. Tezcan et al., "Sloped through wafer vias for 3D wafer level packaging," in Proc. 57th IEEE ECTC 2007, Reno, NV, May 29-Jun. 1, 2007.
-
(2007)
Proc. 57th IEEE ECTC 2007
-
-
Tezcan, D.S.1
-
8
-
-
46049098824
-
3D integration by Cu Cu thermo-compression bonding of extremely thinned bulk-Si die containing 10 μm pitch through-Si vias
-
B. Swinnen et al., "3D integration by Cu Cu thermo-compression bonding of extremely thinned bulk-Si die containing 10 μm pitch through-Si vias," in IEEE Int. Electron Devices Meeting Tech. Dig., 2006, pp. 371-374.
-
(2006)
IEEE Int. Electron Devices Meeting Tech. Dig
, pp. 371-374
-
-
Swinnen, B.1
-
9
-
-
34748922456
-
Simultaneous Cu-Cu and compliant dielectric bond-ing for 3D Stacking of ICs
-
A. Jourdain et al., "Simultaneous Cu-Cu and compliant dielectric bond-ing for 3D Stacking of ICs," in Proc. Int. Interconnect Technology Conf., 2007, pp. 207-209.
-
(2007)
Proc. Int. Interconnect Technology Conf
, pp. 207-209
-
-
Jourdain, A.1
-
11
-
-
0033699518
-
Multiple Si layer ICs: Motivation, performance analysis and design implications
-
S. Souri, K. Banerjee, A. Mehrotra, and K. Saraswat, "Multiple Si layer ICs: Motivation, performance analysis and design implications," in Proc. Conf. Design Automation, 2000, pp. 213-220.
-
(2000)
Proc. Conf. Design Automation
, pp. 213-220
-
-
Souri, S.1
Banerjee, K.2
Mehrotra, A.3
Saraswat, K.4
-
12
-
-
0034462309
-
System level performance evaluation of three-dimensional integrated circuits
-
A. Rahman and R. Reif, "System level performance evaluation of three-dimensional integrated circuits," IEEE Trans. VLSI Syst., vol. x, no. 6, pp. 671-678, 2000.
-
(2000)
IEEE Trans. VLSI Syst
, vol.10
, Issue.6
, pp. 671-678
-
-
Rahman, A.1
Reif, R.2
-
13
-
-
34547322811
-
Interconnects in the third dimension: Design challenges for 3D IC,
-
K. Bernstein, P. Andry, J. Cann, P. Emma, D. Greenberg, W. Haensch, M. Ignatowski, S. Koester, J. Magerlein, R. Puri, and A. Young, "Interconnects in the third dimension: Design challenges for 3D IC, " in Proc. Design Autom. Conf., 2007.
-
(2007)
Proc. Design Autom. Conf
-
-
Bernstein, K.1
Andry, P.2
Cann, J.3
Emma, P.4
Greenberg, D.5
Haensch, W.6
Ignatowski, M.7
Koester, S.8
Magerlein, J.9
Puri, R.10
Young, A.11
-
14
-
-
33947407658
-
Three-dimensional integrated circuits and the future of systems-on-chip designs
-
R. S. Patti, "Three-dimensional integrated circuits and the future of systems-on-chip designs," Proc. IEEE, vol. 94, no. 6, pp. 1214-1224, 2006.
-
(2006)
Proc. IEEE
, vol.94
, Issue.6
, pp. 1214-1224
-
-
Patti, R.S.1
-
15
-
-
28344452134
-
Demystifying 3D ICs: The pros and cons of going vertical
-
W. R. Davis, J. Wilson, S. Mick, J. Xu, H. Hua, C Mineo, A. Suie, M. Steer, and P. D. Franzon, "Demystifying 3D ICs: The pros and cons of going vertical," IEEE Des. Test Comput., vol. 22, no. 6, pp. 498-510, 2005.
-
(2005)
IEEE Des. Test Comput
, vol.22
, Issue.6
, pp. 498-510
-
-
Davis, W.R.1
Wilson, J.2
Mick, S.3
Xu, J.4
Hua, H.5
Mineo, C.6
Suie, A.7
Steer, M.8
Franzon, P.D.9
-
16
-
-
0030291023
-
Performance improvements of the memory hierarchy of RISC-Systems by application of 3D-Technology
-
Nov
-
M. B. Kleiner et al., "Performance improvements of the memory hierarchy of RISC-Systems by application of 3D-Technology," IEEE Trans. Compon., Packag. Manuf. Technol. B, vol. 19, no. 4, pp. 709-718, Nov. 1996.
-
(1996)
IEEE Trans. Compon., Packag. Manuf. Technol. B
, vol.19
, Issue.4
, pp. 709-718
-
-
Kleiner, M.B.1
-
17
-
-
34547476643
-
PicoServer: Using 3D stacking technology to enable a compact energy efficient chip multiprocessor
-
T. Kgil et al., "PicoServer: Using 3D stacking technology to enable a compact energy efficient chip multiprocessor," in Proc. Conf. Architect. Support Program. Lang. Oper. Syst. (ASPLOS 06), 2006, pp. 117-128.
-
(2006)
Proc. Conf. Architect. Support Program. Lang. Oper. Syst. (ASPLOS 06)
, pp. 117-128
-
-
Kgil, T.1
-
18
-
-
28344453642
-
Bridging the processor-memory performance gap with 3D IC technology
-
C. C Liu, I. Ganusov, M. Burtscher, and S. Tiwari, "Bridging the processor-memory performance gap with 3D IC technology," IEEE Des. Test Comput., vol. 22, no. 6, pp. 556-564, 2005.
-
(2005)
IEEE Des. Test Comput
, vol.22
, Issue.6
, pp. 556-564
-
-
Liu, C.C.1
Ganusov, I.2
Burtscher, M.3
Tiwari, S.4
-
19
-
-
33845914023
-
Design and management of 3D chip multiprocessors using network-in-memory
-
F. Li et al., "Design and management of 3D chip multiprocessors using network-in-memory," in Proc. 33rd Ann. Int. Symp. Comput. Architect. (ISCA 06), 2006, pp. 130-141.
-
(2006)
Proc. 33rd Ann. Int. Symp. Comput. Architect. (ISCA 06)
, pp. 130-141
-
-
Li, F.1
-
20
-
-
28344455920
-
First-order performance prediction of cache memory with wafer-level 3D integration
-
A. Zeng, J. Li, K. Rose, and R. J. Gutmann, "First-order performance prediction of cache memory with wafer-level 3D integration," IEEE Des. Test Comput., vol. 22, no. 6, pp. 548-555, 2005.
-
(2005)
IEEE Des. Test Comput
, vol.22
, Issue.6
, pp. 548-555
-
-
Zeng, A.1
Li, J.2
Rose, K.3
Gutmann, R.J.4
-
21
-
-
33748563957
-
Implementing caches in a 3d technology for high performance processors
-
San Jose, CA
-
K. Puttaswamy and G. Loh, "Implementing caches in a 3d technology for high performance processors," in Proc. Int. Conf. Comput. Design, San Jose, CA, 2005.
-
(2005)
Proc. Int. Conf. Comput. Design
-
-
Puttaswamy, K.1
Loh, G.2
-
22
-
-
33746603614
-
Three-dimensional cache design exploration using 3dcacti
-
Y. Tsai, Y. Xie, V. Narayanan, and M. Irwin, "Three-dimensional cache design exploration using 3dcacti," in Proc. IEEE Int. Conf. Comput. Design (ICCDVS), pp. 519-524.
-
Proc. IEEE Int. Conf. Comput. Design (ICCDVS)
, pp. 519-524
-
-
Tsai, Y.1
Xie, Y.2
Narayanan, V.3
Irwin, M.4
-
23
-
-
34548359365
-
Processor design in three-dimensional die-stacking technologies
-
May-Jun
-
G. Loh, Y. Xie, and B. Black, "Processor design in three-dimensional die-stacking technologies," IEEE Micro, vol. 27, no. 3, May-Jun. 2007.
-
(2007)
IEEE Micro
, vol.27
, Issue.3
-
-
Loh, G.1
Xie, Y.2
Black, B.3
-
24
-
-
17644378782
-
3D processing technology and its impact on IA32 microprocessors
-
Oct
-
B. Black, D. Nelson, C. Webb, and N. Samra, "3D processing technology and its impact on IA32 microprocessors," in Proc. Int. Conf. Comput. Design, Oct. 2004, pp. 316-318.
-
(2004)
Proc. Int. Conf. Comput. Design
, pp. 316-318
-
-
Black, B.1
Nelson, D.2
Webb, C.3
Samra, N.4
-
25
-
-
33748631273
-
An automated design flow for 3D microarchitecture evaluation
-
J. Cong et al., "An automated design flow for 3D microarchitecture evaluation," in Proc. Asia Pacific DAC 2006, 2006, pp. 384-389.
-
(2006)
Proc. Asia Pacific DAC 2006
, pp. 384-389
-
-
Cong, J.1
-
27
-
-
84867757431
-
Supporting vertical links for 3D networks on chip: Toward an automated design and analysis flow
-
Catania, Italy, Sep. 24-26
-
I. Loi et al., "Supporting vertical links for 3D networks on chip: Toward an automated design and analysis flow," in Proc. Nano-Net Conf 2007, Catania, Italy, Sep. 24-26, 2007.
-
(2007)
Proc. Nano-Net Conf 2007
-
-
Loi, I.1
-
28
-
-
39049113371
-
Yield and cost modeling for 3d chip stack technologies
-
P. Mercier, S. Singh, K. Iniewski, B. Moore, and P. O'Shea, "Yield and cost modeling for 3d chip stack technologies," in Proc. IEEE Conf. Custom Integr. Circuits 2006, pp. 357-360.
-
(2006)
Proc. IEEE Conf. Custom Integr. Circuits
, pp. 357-360
-
-
Mercier, P.1
Singh, S.2
Iniewski, K.3
Moore, B.4
O'Shea, P.5
-
29
-
-
49849099251
-
Extending systems-on-chip to the third dimension: Performance, cost and technological tradeoffs
-
R. Weerasekera, L. Zheng, D. Pamunuwa, and H. Tenhunen, "Extending systems-on-chip to the third dimension: Performance, cost and technological tradeoffs," in Proc. Int. Conf. Comput. Aided Design 2007, pp. 15-64.
-
(2007)
Proc. Int. Conf. Comput. Aided Design
, pp. 15-64
-
-
Weerasekera, R.1
Zheng, L.2
Pamunuwa, D.3
Tenhunen, H.4
-
30
-
-
28344435928
-
Physical design for 3D system on package
-
S. K. Lim, "Physical design for 3D system on package," IEEE Des. Test Comput., vol. 22, no. 6, pp. 532-539, 2005.
-
(2005)
IEEE Des. Test Comput
, vol.22
, Issue.6
, pp. 532-539
-
-
Lim, S.K.1
-
31
-
-
84942012494
-
Three-dimensional integrated circuits: Performance, design methodology, and CAD tools
-
Tampa, FL, USA, Feb
-
S. Das, A. Chandrakasan, and R. Reif, "Three-dimensional integrated circuits: Performance, design methodology, and CAD tools," in Proc. Int. Symp. VLSI, Tampa, FL, USA, Feb. 2003, pp. 13-18.
-
(2003)
Proc. Int. Symp. VLSI
, pp. 13-18
-
-
Das, S.1
Chandrakasan, A.2
Reif, R.3
-
32
-
-
84954424983
-
Design tools for 3D integrated circuits
-
Jan
-
S. Das, A. Chandrakasan, and R. Reif, "Design tools for 3D integrated circuits," in Proc. ASP-DAC, Jan. 2003, pp. 53-56.
-
(2003)
Proc. ASP-DAC
, pp. 53-56
-
-
Das, S.1
Chandrakasan, A.2
Reif, R.3
-
33
-
-
33750928184
-
Systems-on-chip integration
-
May
-
"Systems-on-chip integration," Proc. IEEE, vol. 89, pp. 602-633, May 2001.
-
(2001)
Proc. IEEE
, vol.89
, pp. 602-633
-
-
-
34
-
-
2442452519
-
2.5D system integration: A design driven system implementation schema
-
Y. Deng and W. Maly, "2.5D system integration: A design driven system implementation schema," in Proc. ASPDAC, 2004, pp. 450-455.
-
(2004)
Proc. ASPDAC
, pp. 450-455
-
-
Deng, Y.1
Maly, W.2
-
35
-
-
33645668035
-
Placement of thermal vias in 3-D ICs using various thermal objectives
-
B. Goplen and S. Sapatnekar, "Placement of thermal vias in 3-D ICs using various thermal objectives," IEEE Trans. Computer-Aided Design Integr. Circuits Syst., vol. 25, no. 4, pp. 692-709.
-
IEEE Trans. Computer-Aided Design Integr. Circuits Syst
, vol.25
, Issue.4
, pp. 692-709
-
-
Goplen, B.1
Sapatnekar, S.2
-
36
-
-
33947592223
-
Efficient thermal via planning approach and its implications on 3-D floorplanning
-
Z. Li, X. Hong, Q. Zhou, S. Zeng, J. Bian, W. Yu, H. Yang, V. Pitchumani, and C. Cheng, "Efficient thermal via planning approach and its implications on 3-D floorplanning," IEEE Trans. Computer-Aided Design Integr. Circuits Syst., vol. 26, no. 4, pp. 645-658.
-
IEEE Trans. Computer-Aided Design Integr. Circuits Syst
, vol.26
, Issue.4
, pp. 645-658
-
-
Li, Z.1
Hong, X.2
Zhou, Q.3
Zeng, S.4
Bian, J.5
Yu, W.6
Yang, H.7
Pitchumani, V.8
Cheng, C.9
-
37
-
-
50249153041
-
D-STAF: Scalable temperature and leakage aware floor-planning for 3D integrated circuits
-
P. Zhou, Y. Ma, Z. Li, R. Dick, L. Shang, H. Zhou, X. Hong, and Q. Zhou, "D-STAF: Scalable temperature and leakage aware floor-planning for 3D integrated circuits," in Proc. Int. Conf. Comput. Aided Design, 2007.
-
(2007)
Proc. Int. Conf. Comput. Aided Design
-
-
Zhou, P.1
Ma, Y.2
Li, Z.3
Dick, R.4
Shang, L.5
Zhou, H.6
Hong, X.7
Zhou, Q.8
-
38
-
-
16244385917
-
A thermal-driven floorplanning algorithm for 3D ICs
-
J. Cong, J. Wei, and Y. Zhang, "A thermal-driven floorplanning algorithm for 3D ICs," in Proc. Int. Conf. Comput. Aided Design, 2004, pp. 306-313.
-
(2004)
Proc. Int. Conf. Comput. Aided Design
, pp. 306-313
-
-
Cong, J.1
Wei, J.2
Zhang, Y.3
-
39
-
-
84861422150
-
Thermal driven multi-level routing for 3-D ICs
-
J. Cong et al., "Thermal driven multi-level routing for 3-D ICs," in Proc. Asia-Pacific DAC 2005, 2005, pp. 121-126.
-
(2005)
Proc. Asia-Pacific DAC 2005
, pp. 121-126
-
-
Cong, J.1
-
40
-
-
33846192734
-
ISAC: Integrated space and time adaptive chip-package thermal analysis
-
Jan
-
Y. Yang, Z. P. Gu, C. Zhu, R. P. Dick, and L. Shang, "ISAC: Integrated space and time adaptive chip-package thermal analysis," IEEE Trans. Computer-Aided Design Integr. Circuits Syst., Jan. 2007.
-
(2007)
IEEE Trans. Computer-Aided Design Integr. Circuits Syst
-
-
Yang, Y.1
Gu, Z.P.2
Zhu, C.3
Dick, R.P.4
Shang, L.5
-
41
-
-
84886735141
-
Interconnect and thermal-aware floorplanning for 3D microprocessors
-
W.-L. Hung et al., "Interconnect and thermal-aware floorplanning for 3D microprocessors," in Proc. Int. Symp. Quality Electron. Design (ISQED) 2006, 2006, pp. 98-104.
-
(2006)
Proc. Int. Symp. Quality Electron. Design (ISQED) 2006
, pp. 98-104
-
-
Hung, W.-L.1
-
42
-
-
84855554120
-
Thermal analysis of heterogeneous 3D-IC for various scenarios
-
T. Chiang, S. Souri, C. Chiu, and K. Saraswat, "Thermal analysis of heterogeneous 3D-IC for various scenarios," in Proc. IEDM, 2001, pp. 682-686.
-
(2001)
Proc. IEDM
, pp. 682-686
-
-
Chiang, T.1
Souri, S.2
Chiu, C.3
Saraswat, K.4
-
43
-
-
84864864951
-
Thermal trends in emerging technologies
-
G. Link and Vijaykrishnan, "Thermal trends in emerging technologies," in Proc. ISQED, 2006.
-
(2006)
Proc. ISQED
-
-
Link, G.1
Vijaykrishnan2
-
44
-
-
34547204691
-
A thermally aware performance analysis of vertically integrated (3D) processor memory hierarchy
-
G. L. Loi et al., "A thermally aware performance analysis of vertically integrated (3D) processor memory hierarchy," in Proc. 43rd Design Autom. Conf. (DAC), 2006, pp. 991-996.
-
(2006)
Proc. 43rd Design Autom. Conf. (DAC)
, pp. 991-996
-
-
Loi, G.L.1
-
45
-
-
0035707480
-
Impact of three-dimensional architectures on interconnects in gigascale integration
-
Dec
-
J. Joyner, R. Venkatesan, P. Zarkesh-Ha, A. Davis, and J. Meindl, "Impact of three-dimensional architectures on interconnects in gigascale integration," IEEE Trans. VLSI Syst., vol. 9, Dec. 2001.
-
(2001)
IEEE Trans. VLSI Syst
, vol.9
-
-
Joyner, J.1
Venkatesan, R.2
Zarkesh-Ha, P.3
Davis, A.4
Meindl, J.5
-
46
-
-
84933384775
-
The software radio architecture
-
May
-
J. Mitola, "The software radio architecture," IEEE Commun. Mag., vol. 33, no. 5, pp. 26-38, May 1995.
-
(1995)
IEEE Commun. Mag
, vol.33
, Issue.5
, pp. 26-38
-
-
Mitola, J.1
-
47
-
-
84863735186
-
Energy-efficient software-defined radio solutions for MIMO-based broadband communication
-
Poznan, Poland, Sep
-
B. Bougard, A. Bourdoux et al., "Energy-efficient software-defined radio solutions for MIMO-based broadband communication," in Proc. Eur. Signal Process. Conf. (EUSIPCO), Poznan, Poland, Sep. 2007.
-
(2007)
Proc. Eur. Signal Process. Conf. (EUSIPCO)
-
-
Bougard, B.1
Bourdoux, A.2
|