3D stacked power distribution considering substrate coupling

Proceedings - IEEE International Conference on Computer Design: VLSI in Computers and Processors

Volumn , Issue , 2009, Pages 225-230

  Shayan, Amirali ^a   Hu, Xiang ^a   Zhang, Wanping ^a   Cheng, Chung Kuan ^a   Engin, A Ege ^b   Chen, Xiaoming ^c   Popovich, Mikhail ^c  

^a UNIVERSITY OF CALIFORNIA   (United States)

^b SAN DIEGO STATE UNIVERSITY   (United States)

^c QUALCOMM INC   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ANALYTICAL MODEL; COMPREHENSIVE MODELING; CONVENTIONAL SYSTEMS; FREQUENCY DEPENDENT; FREQUENCY DOMAINS; OPTIMIZATION PROBLEMS; PARASITICS; POWER DISTRIBUTION NETWORK; POWER DISTRIBUTIONS; POWER GRIDS; POWER NOISE; PROBLEM FORMULATION; SOLUTION TECHNIQUES; SUBSTRATE COUPLINGS; THERMO-MECHANICAL STRESS; THROUGH SILICON VIAS;

DESIGN; DISTRIBUTED PARAMETER NETWORKS; ELECTRIC NETWORK ANALYSIS; POWER GENERATION; STRESSES;

FREQUENCY DOMAIN ANALYSIS;

EID: 77950977359     PISSN: 10636404     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ICCD.2009.5413151     Document Type: Conference Paper

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