Three-dimensional coaxial through-silicon-via (TSV) design

IEEE Electron Device Letters

Volumn 33, Issue 10, 2012, Pages 1441-1443

  Xu, Zheng ^a   Lu, Jian Qiang ^b  

^a IBM MICROELECTRONICS   (United States)

^b RENSSELAER POLYTECHNIC INSTITUTE   (United States)

Author keywords

3 D integration; Coaxial; modeling; parasitics extraction; RLGC; through silicon via (TSV)

Indexed keywords

3-D INTEGRATION; COAXIAL; PARASITICS; RLGC; THROUGH-SILICON-VIA;

ELECTRONICS PACKAGING; MODELS;

THREE DIMENSIONAL;

EID: 84866911870     PISSN: 07413106     EISSN: None     Source Type: Journal    
DOI: 10.1109/LED.2012.2207703     Document Type: Article

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