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Volumn 34, Issue 6, 2002, Pages 349-362

Measuring intrinsic elastic modulus of Pb/Sn solder alloys

Author keywords

[No Author keywords available]

Indexed keywords

COMPUTATIONAL METHODS; DEFORMATION; ELASTIC MODULI; ELASTICITY; EUTECTICS; GRAIN SIZE AND SHAPE; INDENTATION; LEAD ALLOYS; SINGLE CRYSTALS; STRAIN RATE; STRESS ANALYSIS; ULTRASONIC TESTING;

EID: 0036608961     PISSN: 01676636     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0167-6636(02)00131-X     Document Type: Article
Times cited : (57)

References (41)
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    • (2002) Int. J. Damage Mech. , vol.11 , Issue.1 , pp. 87
    • Basaran, C.1    Tang, H.2
  • 14
    • 0009575786 scopus 로고
    • The properties of near-eutectic tin/lead solder alloy tested between +70 °C and -60 °C and the use of such alloy in spacecraft electronics
    • European Space Agency, September
    • (1975) Technical Memorandum ESA TM-162
    • Dun, B.D.1
  • 28
    • 0031236089 scopus 로고    scopus 로고
    • A nonlinear multi-domain thermomechanical stress analysis method for surface mount solder joints - Part II: Viscoplastic analysis
    • (2000) J. Electron. Packaging , vol.119 , pp. 177-182
    • Ling, S.1    Dasgupta, A.2
  • 30
    • 0041760448 scopus 로고    scopus 로고
    • Elastic and plastic properties of thin film on substrates: Nanoindentation techniques
    • (1997) Mater. Sci. Eng. A , vol.234-236 , pp. 37-44
    • Nix, W.D.1
  • 31
    • 0026875935 scopus 로고
    • An improved technique for determining hardness and elastic modulus using load and displacement sensing indentation experiments
    • (1992) J. Mater. Res. , vol.7 , Issue.6 , pp. 102-113
    • Oliver, W.C.1    Pharr, G.M.2
  • 39
    • 0035388805 scopus 로고    scopus 로고
    • Influence of microstructure coarsening on thermomechanical fatigue behavior of Pb/Sn eutectic solder joints
    • (2001) Int. J. Damage Mech. , vol.10 , Issue.3 , pp. 235-255
    • Tang, H.1    Basaran, C.2


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.