High-temperature die-attaches for SiC power devices

Proceedings of the 2011 14th European Conference on Power Electronics and Applications, EPE 2011

Volumn , Issue , 2011, Pages

  Masson, Amandine ^a   Buttay, Cyril ^a   Morel, Hervé ^a   Raynaud, Christophe ^a   Hascoet, Stanislas ^a   Gremillard, Laurent ^b  

^a UNIVERSITÉ DE LYON   (France)

^b UNIVERSITÉ DE LYON   (France)

Author keywords

High temperature electronics; Nanotechnology; Packaging; Reliability; Silicon carbide

Indexed keywords

HIGH TEMPERATURE APPLICATIONS; NANOTECHNOLOGY; PACKAGING; RELIABILITY; SILICON CARBIDE; SINTERING;

HARSH ENVIRONMENT; HIGH TEMPERATURE; HIGH-TEMPERATURE ELECTRONICS; NANO SILVER; NEW SOLUTIONS; POWER DEVICES; SIC DEVICES; TRANSIENT LIQUID PHASE BONDING;

POWER SEMICONDUCTOR DEVICES;

EID: 80053557512     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

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