-
1
-
-
33745010097
-
Impact of SiC power electronic devices for hybrid electric vehicles
-
June 3-5, Arlington, Virginia. (SAE Paper Number 2002-01-1904)
-
Leon M. Tolbert, Burak Ozpineci, Syed K. Islam, Fang Z. Peng, "Impact of SiC Power Electronic Devices for Hybrid Electric Vehicles," 2002 Future Car Congress Proceedings, June 3-5, 2002, Arlington, Virginia. (SAE Paper Number 2002-01-1904)
-
(2002)
2002 Future Car Congress Proceedings
-
-
Tolbert, L.M.1
Ozpineci, B.2
Islam, S.K.3
Peng, F.Z.4
-
2
-
-
0342571640
-
Static and dynamic characteristics of 4H-SiC JFETs designed for different blocking categories
-
P. Friedrichs, H. Mitlehner, R. Kaltschmidt, U. Weinert, W. Bartsch, C. Hecht, K.O. Dohnke, B. Weis, D. Stephani, "Static and dynamic characteristics of 4H-SiC JFETs designed for different blocking categories," Materials Science Forum, vol.338, 2000, p. 1243-6.
-
(2000)
Materials Science Forum
, vol.338
, pp. 1243-1246
-
-
Friedrichs, P.1
Mitlehner, H.2
Kaltschmidt, R.3
Weinert, U.4
Bartsch, W.5
Hecht, C.6
Dohnke, K.O.7
Weis, B.8
Stephani, D.9
-
3
-
-
33746557344
-
The package and heatsink technique for the high temperature, high power density electronics devices
-
December 2-5, Orlando, FL
-
rd Army Science Conference, December 2-5, 2002, Orlando, FL
-
(2002)
rd Army Science Conference
-
-
Lin, Z.1
Yoon, R.2
Burke, T.3
-
4
-
-
0013341959
-
High performance packaging materials and architectures for improved thermal management of power electronics
-
Kevin A. Moores and Yogendra K. Joshi, "High Performance Packaging Materials and Architectures for Improved Thermal Management of Power Electronics", Future Circuits International, No.7, 2001, pp.45-9
-
(2001)
Future Circuits International
, Issue.7
, pp. 45-49
-
-
Moores, K.A.1
Joshi, Y.K.2
-
6
-
-
3943076426
-
Aluminum nitride package for high temperature applications
-
Albuquerque, NM
-
F. M. Brutcher, R. J. Yoon, and B. Whitworth, "Aluminum Nitride Package for High Temperature Applications", Third International High Temperature Electronic Conference, 1996, Albuquerque, NM.
-
(1996)
Third International High Temperature Electronic Conference
-
-
Brutcher, F.M.1
Yoon, R.J.2
Whitworth, B.3
-
7
-
-
0025444866
-
High thermal conductivity aluminum nitride ceramic substrates and packages
-
F. Miyashiro, N. Iwase, A. Tsuge, F. Ueno, M. Nakahashi, and T. Takahashi, "High Thermal Conductivity Aluminum Nitride Ceramic Substrates and Packages", IEEE Trans. on Components, Hybrids, and Manufacturing Technology, Vol.13, 1990, pp.313
-
(1990)
IEEE Trans. on Components, Hybrids, and Manufacturing Technology
, vol.13
, pp. 313
-
-
Miyashiro, F.1
Iwase, N.2
Tsuge, A.3
Ueno, F.4
Nakahashi, M.5
Takahashi, T.6
-
9
-
-
0021650724
-
Aluminum nitride: An alternative ceramics substrate for high power applications in microcircuits
-
W. Werdecker and F. Aldinger, "Aluminum Nitride: An Alternative Ceramics Substrate for High Power Applications in Microcircuits", IEEE Trans. CHMT, Vol. 7, 1984, pp.399
-
(1984)
IEEE Trans. CHMT
, vol.7
, pp. 399
-
-
Werdecker, W.1
Aldinger, F.2
-
10
-
-
0038587604
-
Carbon foams for thermal management
-
Nidia C Gallego, James Klett, "Carbon Foams for Thermal Management", Carbon, vol. 41, 2003, pp. 1461
-
(2003)
Carbon
, vol.41
, pp. 1461
-
-
Gallego, N.C.1
Klett, J.2
-
11
-
-
85072463021
-
A strength-enhanced, high-efficiency carbon foam radiator
-
April 11-14, Cobo Center, Detroit, Michigan (SAE Paper Number 2005-01-0594)
-
Zhigang Lin, Rick Yoon, X.A. Zhu, C. T. Tsai, Jeffrey Kozierowski and Wsewolod Hnatczuk, "A Strength-enhanced, High-efficiency Carbon Foam Radiator", 2005 Society of Automotive Engineering (SAE) World Congress and Exposition, April 11-14, 2005, Cobo Center, Detroit, Michigan (SAE Paper Number 2005-01-0594)
-
(2005)
2005 Society of Automotive Engineering (SAE) World Congress and Exposition
-
-
Lin, Z.1
Yoon, R.2
Zhu, X.A.3
Tsai, C.T.4
Kozierowski, J.5
Hnatczuk, W.6
-
12
-
-
33746554228
-
A high-efficiency, lightweight graphite foam heatsink: Strength enhancement and structure design
-
submitted
-
Zhigang Lin, Rick Yoon, X.A. Zhu, C. T. Tsai, Jeffrey Kozierowski and Wsewolod Hnatczuk, "A High-efficiency, Lightweight Graphite Foam Heatsink: Strength Enhancement and Structure Design" IEEE Trans. on Components, Packaging, and Manufacturing Technology (submitted)
-
IEEE Trans. on Components, Packaging, and Manufacturing Technology
-
-
Lin, Z.1
Yoon, R.2
Zhu, X.A.3
Tsai, C.T.4
Kozierowski, J.5
Hnatczuk, W.6
|