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Volumn 2005, Issue , 2005, Pages 156-159

An AlN-based high temperature package for SiC devices: Materials and processing

Author keywords

[No Author keywords available]

Indexed keywords

ALUMINUM NITRIDE; ELECTRONIC DENSITY OF STATES; HIGH TEMPERATURE EFFECTS; MICROELECTRONIC PROCESSING; SILICON COMPOUNDS; SUBSTRATES;

EID: 33746542522     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper
Times cited : (14)

References (12)
  • 1
    • 33745010097 scopus 로고    scopus 로고
    • Impact of SiC power electronic devices for hybrid electric vehicles
    • June 3-5, Arlington, Virginia. (SAE Paper Number 2002-01-1904)
    • Leon M. Tolbert, Burak Ozpineci, Syed K. Islam, Fang Z. Peng, "Impact of SiC Power Electronic Devices for Hybrid Electric Vehicles," 2002 Future Car Congress Proceedings, June 3-5, 2002, Arlington, Virginia. (SAE Paper Number 2002-01-1904)
    • (2002) 2002 Future Car Congress Proceedings
    • Tolbert, L.M.1    Ozpineci, B.2    Islam, S.K.3    Peng, F.Z.4
  • 3
    • 33746557344 scopus 로고    scopus 로고
    • The package and heatsink technique for the high temperature, high power density electronics devices
    • December 2-5, Orlando, FL
    • rd Army Science Conference, December 2-5, 2002, Orlando, FL
    • (2002) rd Army Science Conference
    • Lin, Z.1    Yoon, R.2    Burke, T.3
  • 4
    • 0013341959 scopus 로고    scopus 로고
    • High performance packaging materials and architectures for improved thermal management of power electronics
    • Kevin A. Moores and Yogendra K. Joshi, "High Performance Packaging Materials and Architectures for Improved Thermal Management of Power Electronics", Future Circuits International, No.7, 2001, pp.45-9
    • (2001) Future Circuits International , Issue.7 , pp. 45-49
    • Moores, K.A.1    Joshi, Y.K.2
  • 9
    • 0021650724 scopus 로고
    • Aluminum nitride: An alternative ceramics substrate for high power applications in microcircuits
    • W. Werdecker and F. Aldinger, "Aluminum Nitride: An Alternative Ceramics Substrate for High Power Applications in Microcircuits", IEEE Trans. CHMT, Vol. 7, 1984, pp.399
    • (1984) IEEE Trans. CHMT , vol.7 , pp. 399
    • Werdecker, W.1    Aldinger, F.2
  • 10
    • 0038587604 scopus 로고    scopus 로고
    • Carbon foams for thermal management
    • Nidia C Gallego, James Klett, "Carbon Foams for Thermal Management", Carbon, vol. 41, 2003, pp. 1461
    • (2003) Carbon , vol.41 , pp. 1461
    • Gallego, N.C.1    Klett, J.2


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.