Nanoindentation of lead-free solders in microelectronic packaging

Materials Science and Engineering: A

Volumn 448, Issue 1-2, 2007, Pages 340-344

  Liu, C Z ^a,b   Chen, J ^a  

^a INSTITUTE OF METAL RESEARCH   (China)

^b SHENYANG AEROSPACE UNIVERSITY   (China)

Author keywords

Creep; Hardness; Modulus; Nanoindentation; Solder

Indexed keywords

CREEP; ELECTRONICS PACKAGING; EUTECTICS; HARDNESS; INDENTATION; LEAD ALLOYS; MECHANICAL PROPERTIES; TENSILE TESTING; TIN ALLOYS;

LEAD-FREE SOLDERS; MICROELECTRONIC PACKAGING; NANOINDENTATION;

SOLDERING ALLOYS;

CREEP; ELECTRONICS PACKAGING; EUTECTICS; HARDNESS; INDENTATION; LEAD ALLOYS; MECHANICAL PROPERTIES; SOLDERING ALLOYS; TENSILE TESTING; TIN ALLOYS;

EID: 33846829944     PISSN: 09215093     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.msea.2006.10.056     Document Type: Article

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