Elastic properties of Sn-based Pb-free solder alloys determined by ultrasonic pulse echo method

Materials Transactions

Volumn 46, Issue 6, 2005, Pages 1271-1273

  Tanaka, Hiroyuki ^a   Qun, Lang Feng ^b   Munekata, Osamu ^c   Taguchi, Toshihiko ^c   Narita, Toshio ^b  

^a HOKKAIDO INDUSTRIAL RESEARCH INSTITUTE   (Japan)

^b HOKKAIDO UNIVERSITY   (Japan)

^c SENJU METAL INDUSTRY CO LTD   (Japan)

Author keywords

Lead free solder; Poisson's ratio; Ultrasonic pulse echo method; Young's modulus

Indexed keywords

COMPUTER SIMULATION; ELASTIC MODULI; EUTECTICS; GRAIN BOUNDARIES; INTERNAL FRICTION; LEAD; POISSON RATIO; TIN ALLOYS; ULTRASONIC EFFECTS;

EUTECTIC STRUCTURE; LEAD FREE SOLDER; LONGITUDINAL WAVES; ULTRASONIC PULSE ECHO METHOD;

SOLDERING ALLOYS;

EID: 23744488344     PISSN: 13459678     EISSN: None     Source Type: Journal    
DOI: 10.2320/matertrans.46.1271     Document Type: Article

References (7)

1. John H. Lau: Solder Joint Reliability, (Van Nostrand Reinhold, 1990) pp. 455-477.
2. John H. Lau and Yi-Hsin Pao: Solder Joint Reliability of BGA, CSP, Filp Chip, and Fine Pitch SMT Assemblies, (McGrawHill, 1997) pp. 132-147.
3. NCMS: Lead-Free Solder Project Final Report, (NCMS, Ann Arbor, MI, August 1997) pp. 2-1-2-5.
4. NIST: Database for Solder Properties with Emphasis on New Lead-free Solders, (February 2002) pp. 8-31.
5. H. Kamioka: JJAP 22 (1983) 1805-1809.
6. Alan Wolfenden : Dynamic Elastic Modulus Measurements in Materials, (ASTM, 1990) pp. 47-57.
7. M. Fukuhara and I. Yamauchi: J. Mater. Sci. 28 (1993) 4681-4688.