Improved strength of Ni and Zn-doped Sn-2.0Ag-0.5Cu lead-free solder alloys under controlled processing parameters

Materials and Design

Volumn 47, Issue , 2013, Pages 607-614

  El Daly, A A ^a   El Taher, A M ^a  

^a Zagazig University   (Egypt)

Author keywords

Lead free solder; Mechanical properties; Microstructure; Sn Ag Cu alloys

Indexed keywords

LEAD; MECHANICAL PROPERTIES; MICROHARDNESS; MICROSTRUCTURE; SILVER; SILVER ALLOYS; SOLDERING ALLOYS; STRAIN HARDENING; STRAIN RATE; TIN ALLOYS; ZINC;

COMPETING EFFECTS; CU CONTENT; DISLOCATION PILEUP; DYNAMIC RECOVERY PROCESS; FLIP CHIP INTERCONNECTS; LEAD FREE SOLDERS; LEAD-FREE SOLDER ALLOY; MECHANICAL BEHAVIOR; MICROSTRUCTURE ANALYSIS; PROCESSING PARAMETERS; SN DENDRITES; SN GRAINS; SN-AG-CU; SN-AG-CU ALLOY; SNPB SOLDER; STRAIN AND STRAIN RATES; TOTAL ELONGATIONS; ULTIMATE TENSILE STRENGTH;

TIN;

EID: 84872860518     PISSN: 02641275     EISSN: 18734197     Source Type: Journal    
DOI: 10.1016/j.matdes.2012.12.081     Document Type: Article

References (29)

1. Fallahi H., Nurulakmal M.S., Arezodar A.F., Abdullah J. Effect of iron and indium on IMC formation and mechanical properties of lead-free solder. Mater Sci Eng A 2012, 553:22-31.
2. Choi H., Lee T.K., Kim Y., Kwon H., Tseng C.F., Duh J.G., et al. Improved strength of boron-doped Sn-1.0Ag-0.5Cu solder joints under aging conditions. Intermetallics 2012, 20:155-159.
3. Gong J.C., Liu C.Q., Conway P.P., Silberschmidt V.V. Mater Sci Eng A 2010, 527:2588-2591.
4. Kanlayasiri K., Ariga T. Influence of thermal aging on microhardness and microstructure of Sn-0.3Ag-0.7Cu-xIn lead-free solders. J Alloys Compd 2010, 504:15-19.
5. Xie H.X., Chawla N., Shen Y.L. Mechanisms of deformation in high-ductility Ce containing Sn-Ag-Cu solder alloys. Microelectron Reliab 2011, 51(6):1142-1147.
6. Chen W.M., Kang S.K., Kao C.R. Effects of Ti addition to Sn-Ag and Sn-Cu solders. J Alloys Compd 2012, 520:244-249.
7. 2 composite solder on flexible ball grid array substrates. Microelectron Reliab 2011, 51:975-984.
8. Ventura T., Terzi S., Rappaz M., Dahle A.K. Effects of solidification kinetics on microstructure formation in binary Sn-Cu solder alloys. Acta Mater 2011, 59(4):1651-1658.
9. Gao L., Xue S., Zhang L., Sheng Z., Ji F., Dai W. Effect of alloying elements on properties and microstructures of SnAgCu solders. Microelectron Eng 2010, 87:2025-2034.
10. Zhu F., Zhang H., Guan R., Liu S. Effects of temperature and strain rate on mechanical property of Sn96.5Ag3Cu0.5. J Alloys Compd 2007, 438:100-105.
11. Belyakov S.A., Gourlay C.M. NiSn4 formation during the solidification of Sn-Ni alloys. Intermetallics 2012, 25:48-59.
12. Wang C.H., Shen H.T. Effects of Ni addition on the interfacial reactions between Sn-Cu solders and Ni substrate. Intermetallics 2010, 18:616-622.
13. Gain A.K., Chan Y.C. The influence of a small amount of Al and Ni nano-particles on the microstructure, kinetics and hardness of Sn-Ag-Cu solder on OSP-Cu pads. Intermetallics 2012, 29:48-55.
14. Che F.X., Zhu W.H., Edith S.W.P., Zhang X.W., Zhang X.R. The study of mechanical properties of Sn-Ag-Cu lead-free solders with different Ag contents and Ni doping under different strain rates and temperatures. J Alloys Compd 2010, 507:215-224.
15. Zhang L., He C.W., Guo Y.H., Han J.G., Zhang Y.W., Wang X.Y. Development of SnAg-based lead free solders in electronics packaging. Microelectron Reliab 2012, 52:559-578.
16. Luo Z.-B., Zhao J., Gao Y.-J., Wang L. Revisiting mechanisms to inhibit Ag3Sn plates in Sn-Ag-Cu solders with 1wt.% Zn addition. J Alloys Compd 2010, 500:39-45.
17. El-Daly A.A., Hammad A.E., Fawzy A., Nasrallh D.A. Microstructure, mechanical properties, and deformation behavior of Sn-1.0Ag-0.5Cu solder after Ni and Sb additions. Mater Des 2013, 43:40-49.
18. Shen J., Chang Liu Y., Han Y.J., Wei H.X.C., Yang Y.G. Effects of cooling rates on microstructure and microhardness of lead-free Sn-3.5% Ag solders. Trans Nonferrous Metal Soc China 2006, 16:59-64.
19. 3Sn intermetallic particles of a Sn-Ag solder alloy. Mater Des 2011, 32:3008-3012.
20. Mua D., Yasuda H., Huang H., Nogita K. Growth orientations and mechanical properties of Cu6Sn5 and (Cu, Ni)6Sn5 on poly-crystalline Cu. J Alloys Compd 2012, 536:38-46.
21. El-Daly A.A., Hammad A.E. Development of high strength Sn-0.7Cu solders with the addition of small amount of Ag and In. J Alloys Compd 2011, 509:8554-8560.
22. Niranjani V.L., Chandra Rao B.S.S., Singh V., Kamat S.V. Influence of temperature and strain rate on tensile properties of single walled carbon nanotubes reinforced Sn-Ag-Cu lead free solder alloy composites. Mater Sci Eng A 2011, 529:257-264.
23. Hamada N, Uesugi T, Takigawa Y, Higashi K. Effects of Zn addition and aging treatment on tensile properties of Sn-Ag-Cu alloys. 2012; 527: 226-32.
24. 3Sn compounds and microhardness of Sn3.5Ag0.5Cu nano-composite solders during different cooling rate and aging. Mater Des 2012, 39:475-483.
25. 3 additions on microstructure development and hardness of Sn3.5Ag0.5Cu solder. Mater Des 2010, 31:4831-4835.
26. 3 particles reinforced n3.5Ag0.5Cu lead-free solder. J Mater Sci: Mater Electron 2011, 22:1021-1027.
27. El-Daly A.A., Mohamad A.Z., Fawzy A., El-Taher A.M. Creep behavior of near-peritectic Sn-5Sb solders containing small amount of Ag and Cu. Mater Sci Eng A 2011, 528:1055-1062.
28. El-Daly A.A., Hammad A.E. Enhancement of creep resistance and thermal behavior of eutectic Sn-Cu lead-free solder alloy by Ag and In-additions. Mater Des 2012, 40:292-298.
29. El-Daly A.A., Swilem Y., Hammad A.E. Creep properties of Sn-Sb-based lead-free solder alloys. J Alloys Compd 2009, 471:98-104.