Influence of temperature and strain rate on tensile properties of single walled carbon nanotubes reinforced Sn-Ag-Cu lead free solder alloy composites

Materials Science and Engineering: A

Volumn 529, Issue 1, 2011, Pages 257-264

  Niranjani, V L ^a   Rao, B S S Chandra ^b   Singh, Vajinder ^a   Kamat, S V ^a  

^a DEFENCE METALLURGICAL RESEARCH LABORATORY   (India)

^b NATIONAL UNIVERSITY OF SINGAPORE   (Singapore)

Author keywords

Strain rate; SWCNT reinforced SAC387 lead free solder alloy composite; Temperature; Tensile properties

Indexed keywords

COPPER ALLOYS; LEAD-FREE SOLDERS; REINFORCEMENT; SILVER ALLOYS; SOLDERED JOINTS; STRAIN HARDENING; TEMPERATURE; TENSILE STRENGTH; TERNARY ALLOYS; TIN ALLOYS; YARN;

ALLOY COMPOSITES; EFFECTS OF TEMPERATURE AND STRAIN RATE; LEAD-FREE SOLDER ALLOY; SINGLE-WALLED CARBON; SN-AG-CU LEAD-FREE SOLDERS; STRAIN-RATES; SWCNT REINFORCED SAC387 LEAD FREE SOLDER ALLOY COMPOSITE; TOTAL ELONGATIONS; ULTIMATE TENSILE STRENGTH; WEIGHT PERCENTAGES;

STRAIN RATE;

EID: 80054073458     PISSN: 09215093     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.msea.2011.09.026     Document Type: Article

References (34)

1. Allenby B.R., Ciccarelli J.P. Proceedings of Surface Mount International Conference 1992, 1.
2. Hwang J.S. Implementing Lead-free Electronics 2004, McGraw-Hill, New York.
3. IPC Roadmap - A Guide for Assembly of Lead-free Electronics 2000, IPC, Northbrook, IL.
4. Zeng K., Tu K.N. Mater. Sci. Eng. A 2002, 38:55.
5. Vianco P.T., Shangguan D. Fatigue and Creep of Lead-free Solder Alloys: Fundamental Properties, Chapter 3 Lead Free Solder Interconnect Reliability 2006, ASM International, Materials Park, OH, p. 67.
6. Wiese S., Schubert A., Walter H., Dudek R., Feustel F., Meusel E., Michel B. Proceedings of the 51st Electronic Components and Technology Conference 2001, 890.
7. Puttlitz K.J., Stalter K.A. Handbook of Lead-free Solder Technology for Microelectronic Assemblies 2004, Marcel Decker, New York.
8. Lin J.K., De Silva A., Frear D., Guo Y., Hayes S., Jang J.W., Li L., Mitchell D., Yeung B., Zhang C. IEEE Trans. Electron. Pack. Manuf. 2002, 25:300.
9. Xiao Q., Nguyen L., Armstrong W.D. Proceedings of the 54th Electronic Components and Technology Conference 2004, 1325.
10. Xiao Q., Bailey H.J., Armstrong W.D. J. Electron. Pack. 2004, 126(2):208.
11. Vianco P.T., Rejent J.A., Martin J.J. J. Mater. 2003, 55:50.
12. Vianco P.T., Rejent J.A., Kilgo A.C. J. Electron. Mater. 2003, 32:142.
13. Schubert A., Walter H., Dudek R., Michel B., Lefranc G., Otto J., Mitic G. International Symposium on Advanced Packaging Materials 2001, 129.
14. Fouassier O., Heintz J.M., Chazelas J., Geffroy P.M., Silvaina J.F. J. Appl. Phys. 2006, 100:1.
15. Vianco P.T., Rejent J.A. Compression deformation response of 95.5Sn-3.9Ag-0.6Cu solder. UCLA Workshop on Lead-free Electronics 2002.
16. Shohji I., Yoshida T., Takahashi T., Hioki S. Mater. Sci. Eng. A 2004, 366:50.
17. Pang J.H.L., Xiong B.S. IEEE Trans. Compon. Pack. Technol. 2005, 28(4):830.
18. Chandra Rao B.S.S., Mohan Kumar K., Kripesh V., Zeng K.Y. Mater. Sci. Eng. A 2011, 528:4166.
19. Salvetat-Delmotte J., Rubio A. Carbon 2002, 40:1729.
20. Saether E., Frankland S.J., Pipes R.B. Compos. Sci. Technol. 2003, 63:1543.
21. Mauron P.H., Emmenegger C.H., Züttel A., Nützenadel C.H., Sudan P., Schlapbach L. Carbon 2002, 40:1339.
22. Valentini L., Biagiotti J., Kenny J.M., Santucci S. Compos. Sci. Technol. 2003, 63:1149.
23. Dong S., Zhang X. Trans. Non-Ferrous Met. Soc. China 1999, 9:457.
24. Zhong R., Cong H., Hou P. Carbon 2003, 41:848.
25. Nai S.M.L., Wei J., Gupta M. Mater. Sci. Eng. A 2006, 423:166.
26. Nai S.M.L., Wei J., Gupta M. Thin Solid Films 2006, 504:401.
27. Nai S.M.L., Gupta M., Wei J. Int. J. Nanosci. 2005, 4(4):423.
28. Mohan Kumar K., Kripesh V., Taya A.O. J. Alloys Compd. 2008, 450:229.
29. Lindemann F.A. Phys. Z. 1910, 11:609.
30. Couchman P.R., Ryan C.K. Philos. Mag. A 1978, 37:327.
31. Ziman J.M. Principles of the Theory of Solids 1972, Cambridge University Press, London.
32. Clyens S., Campbell J.D. Inst. Phys. Conf. Ser. 1974, 21:62.
33. Shohji I., Yohshida T., Takahashi T., Hioki S. J. Mater. Sci. 2004, 15:219.
34. Wong E.H., Seah S.K.W., Selvanayagam C.S., Rajoo R., Van Driel W.D., Caers J.F.J.M., Zhao X.J., Owens N., Leoni M., Tan L.C., Frear D.R., Lai Y.-S., Yeh C.-L. J. Electron. Mater. 2008, 38:6.