Effects of solidification kinetics on microstructure formation in binary Sn-Cu solder alloys

Acta Materialia

Volumn 59, Issue 4, 2011, Pages 1651-1658

  Ventura, Tina ^a   Terzi, Sofiane ^a   Rappaz, Michel ^b   Dahle, Arne K ^a  

^a UNIVERSITY OF QUEENSLAND   (Australia)

^b EPFL   (Switzerland)

Author keywords

Dendritic growth; Eutectic; Lead free solder; Solidification

Indexed keywords

CELL BOUNDARY; COUPLED ZONE; DENDRITIC GROWTH; DIRECTIONALLY SOLIDIFIED; EUTECTIC GROWTH; EUTECTIC MORPHOLOGY; IRREGULAR EUTECTIC; LEAD-FREE SOLDER; MICROSTRUCTURE FORMATION; NEAR-EUTECTIC COMPOSITION; SN-CU SOLDERS; SOLIDIFICATION KINETICS;

BINARY ALLOYS; CERIUM ALLOYS; COPPER ALLOYS; EUTECTICS; LEAD; SOLDERED JOINTS; TIN; TIN ALLOYS;

SOLIDIFICATION;

EID: 78651379969     PISSN: 13596454     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.actamat.2010.11.032     Document Type: Article

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