Effects of temperature and strain rate on mechanical property of Sn96.5Ag3Cu0.5

Journal of Alloys and Compounds

Volumn 438, Issue 1-2, 2007, Pages 100-105

  Zhu, Fulong ^a   Zhang, Honghai ^a   Guan, Rongfeng ^a   Liu, Sheng ^a,b  

^a HUAZHONG UNIVERSITY OF SCIENCE AND TECHNOLOGY   (China)

^b Wayne State University   (United States)

Author keywords

Creep resistance; Dynamic recovery; Lead free; Sn Ag Cu; Strain rate sensitivity; Temperature dependence; Work hardening

Indexed keywords

CREEP RESISTANCE; LEAD ALLOYS; MICROELECTRONICS; SOLDERING ALLOYS; STRAIN HARDENING; STRAIN RATE; THERMODYNAMICS;

DYNAMIC RECOVERY; STRAIN RATE SENSITIVITY; TEMPERATURE DEPENDENCE;

TIN COMPOUNDS;

EID: 34247638561     PISSN: 09258388     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.jallcom.2006.08.009     Document Type: Article

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