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Volumn 536, Issue , 2012, Pages 38-46
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Growth orientations and mechanical properties of Cu 6Sn 5 and (Cu,Ni) 6Sn 5 on poly-crystalline Cu
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Author keywords
Crystal growth; Growth orientation; Intermetallics; Mechanical properties; Nanoindentation; Pole figures; Synchrotron radiation; X ray diffraction
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Indexed keywords
AVERAGE VALUES;
CU SUBSTRATE;
CURRENT GENERATION;
ELECTRICAL PACKAGE;
GROWTH MORPHOLOGY;
GROWTH ORIENTATIONS;
HIGH TEMPERATURE;
LEAD FREE SOLDERS;
LEAD-FREE SOLDER ALLOY;
LEGISLATIVE REQUIREMENTS;
LOW COSTS;
NI ADDITIONS;
POLE FIGURE;
POLYCRYSTALLINE;
SOLDER JOINTS;
STANDARD DEVIATION;
CRYSTAL GROWTH;
INTERFACES (MATERIALS);
INTERMETALLICS;
MECHANICAL PROPERTIES;
NANOINDENTATION;
SCANNING ELECTRON MICROSCOPY;
SOLDERING;
SOLDERING ALLOYS;
SYNCHROTRON RADIATION;
TEXTURES;
TIN ALLOYS;
X RAY DIFFRACTION;
TIN;
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EID: 84861883093
PISSN: 09258388
EISSN: None
Source Type: Journal
DOI: 10.1016/j.jallcom.2012.04.110 Document Type: Article |
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Times cited : (60)
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References (36)
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