SCOPUS 정보 검색 플랫폼 - 논문 보기

메뉴 건너뛰기

Journal of Alloys and Compounds

Volumn 520, Issue , 2012, Pages 244-249

Effects of Ti addition to Sn-Ag and Sn-Cu solders

(3) Chen, W M a Kang, S K b Kao, C R a

a NATIONAL TAIWAN UNIVERSITY (Taiwan)

b IBM T J WATSON RESEARCH CENTER (United States)

Author keywords

Minor alloying elements; Pb free solders; Ti addition

Indexed keywords

AGING CONDITIONS; COOLING RATES; HIGH TEMPERATURE AGING; MINOR ALLOYING; PB FREE SOLDERS; SN-AG SOLDER; SN-CU SOLDERS; TI ADDITION;

ALLOYING; ALLOYING ELEMENTS; LEAD; MECHANICAL PROPERTIES; MICROSTRUCTURE; SOLDERING ALLOYS; THERMOANALYSIS;

TIN;

EID: 84862825280 PISSN: 09258388 EISSN: None Source Type: Journal
DOI: 10.1016/j.jallcom.2012.01.032 Document Type: Article

Times cited : (92)

References (25)

1
- 51649139688
- S.K. Kang, and A.K. Sarkhel J. Electron. Mater. 23 1994 701
- (1994) J. Electron. Mater. , vol.23 , pp. 701
- Kang, S.K.¹ Sarkhel, A.K.²

2
- 0038351737
- S.K. Kang, W.K. Choi, D.Y. Shih, D.W. Henderson, T. Gosselin, A. Sarkhel, C. Goldsmith, and K.J. Puttlitz IEEE Electron. Compon. Technol. Conf. 53 2003 64
- (2003) IEEE Electron. Compon. Technol. Conf. , vol.53 , pp. 64
- Kang, S.K.¹ Choi, W.K.² Shih, D.Y.³ Henderson, D.W.⁴ Gosselin, T.⁵ Sarkhel, A.⁶ Goldsmith, C.⁷ Puttlitz, K.J.⁸

3
- 44449118622
- M. Lu, D.Y. Shih, P. Lauro, C. Goldsmith, and D.W. Henderson Appl. Phys. Lett. 92 2008 211909
- (2008) Appl. Phys. Lett. , vol.92 , pp. 211909
- Lu, M.¹ Shih, D.Y.² Lauro, P.³ Goldsmith, C.⁴ Henderson, D.W.⁵

4
- 60849123413
- S.K. Seo, S.K. Kang, D.Y. Shih, and H.M. Lee Microelectron. Reliab. 49 2009 288
- (2009) Microelectron. Reliab. , vol.49 , pp. 288
- Seo, S.K.¹ Kang, S.K.² Shih, D.Y.³ Lee, H.M.⁴

5
- 58349107241
- S.K. Seo, S.K. Kang, D.Y. Shih, and H.M. Lee J. Electron. Mater. 38 2009 257
- (2009) J. Electron. Mater. , vol.38 , pp. 257
- Seo, S.K.¹ Kang, S.K.² Shih, D.Y.³ Lee, H.M.⁴

6
- 77956944829
- S.K. Seo, S.K. Kang, M.G. Cho, and H.M. Lee JOM 62 2010 22
- (2010) JOM , vol.62 , pp. 22
- Seo, S.K.¹ Kang, S.K.² Cho, M.G.³ Lee, H.M.⁴

7
- 0035455514
- I.E. Anderson, J.C. Foley, B.A. Cook, J. Harringa, R.L. Terpstra, and O. Unal J. Electron. Mater. 30 2001 1050
- (2001) J. Electron. Mater. , vol.30 , pp. 1050
- Anderson, I.E.¹ Foley, J.C.² Cook, B.A.³ Harringa, J.⁴ Terpstra, R.L.⁵ Unal, O.⁶

8
- 35248860213
- M.G. Cho, S.K. Kang, D.Y. Shih, and H.M. Lee J. Electron. Mater. 36 2007 1501
- (2007) J. Electron. Mater. , vol.36 , pp. 1501
- Cho, M.G.¹ Kang, S.K.² Shih, D.Y.³ Lee, H.M.⁴

9
- 67349083563
- Y.W. Wang, Y.W. Lin, C.T. Tu, and C.R. Kao J. Alloys Compd. 478 2009 121
- (2009) J. Alloys Compd. , vol.478 , pp. 121
- Wang, Y.W.¹ Lin, Y.W.² Tu, C.T.³ Kao, C.R.⁴

10
- 77953131590
- S.C. Yang, C.C. Chang, M.H. Tsai, and C.R. Kao J. Alloys Compd. 499 2010 149
- (2010) J. Alloys Compd. , vol.499 , pp. 149
- Yang, S.C.¹ Chang, C.C.² Tsai, M.H.³ Kao, C.R.⁴

11
- 67349152353
- Y.W. Wang, C.C. Chang, and C.R. Kao J. Alloys Compd. 478 2009 L1
- (2009) J. Alloys Compd. , vol.478 , pp. 1
- Wang, Y.W.¹ Chang, C.C.² Kao, C.R.³

12
- 77249094499
- Y.W. Wang, Y.W. Lin, and C.R. Kao J. Alloys Compd. 493 2010 233
- (2010) J. Alloys Compd. , vol.493 , pp. 233
- Wang, Y.W.¹ Lin, Y.W.² Kao, C.R.³

13
- 78049528182
- Y.W. Wang, C.C. Chang, W.M. Chen, and C.R. Kao J. Electron. Mater. 39 2010 2636
- (2010) J. Electron. Mater. , vol.39 , pp. 2636
- Wang, Y.W.¹ Chang, C.C.² Chen, W.M.³ Kao, C.R.⁴

14
- 60849105954
- Y.W. Wang, Y.W. Lin, and C.R. Kao Microelectron. Reliab. 49 2009 248
- (2009) Microelectron. Reliab. , vol.49 , pp. 248
- Wang, Y.W.¹ Lin, Y.W.² Kao, C.R.³

15
- 51849128171
- S.C. Yang, Y.W. Wang, C.C. Chang, and C.R. Kao J. Electron. Mater. 37 2008 1591
- (2008) J. Electron. Mater. , vol.37 , pp. 1591
- Yang, S.C.¹ Wang, Y.W.² Chang, C.C.³ Kao, C.R.⁴

16
- 33749863019
- S.C. Yang, C.E. Ho, C.W. Chang, and C.R. Kao J. Mater. Res. 21 2006 2436
- (2006) J. Mater. Res. , vol.21 , pp. 2436
- Yang, S.C.¹ Ho, C.E.² Chang, C.W.³ Kao, C.R.⁴

17
- 51349127878
- W. Liu, P. Bachorik, and N.C. Lee IEEE Electron. Compon. Technol. Conf. 58 2008 452
- (2008) IEEE Electron. Compon. Technol. Conf. , vol.58 , pp. 452
- Liu, W.¹ Bachorik, P.² Lee, N.C.³

18
- 84862813977
- (online)
- V. Vuorinen, H.Q. Dong, and T. Laurila J. Mater. Sci. 22 2011 (online)
- (2011) J. Mater. Sci. , vol.22
- Vuorinen, V.¹ Dong, H.Q.² Laurila, T.³

19
- 10444237976
- P.A. Gruber, D. Shih, L. Belanger, G. Brouillette, D. Danovitch, V. Oberson, M. Turgeon, and H. Kimura IEEE Electron. Compon. Technol. Conf. 54 2004 650
- (2004) IEEE Electron. Compon. Technol. Conf. , vol.54 , pp. 650
- Gruber, P.A.¹ Shih, D.² Belanger, L.³ Brouillette, G.⁴ Danovitch, D.⁵ Oberson, V.⁶ Turgeon, M.⁷ Kimura, H.⁸

20
- 67650739686
- M.G. Cho, H.Y. Kim, S.K. Seo, and H.M. Lee Appl. Phys. Lett. 95 2009 021905
- (2009) Appl. Phys. Lett. , vol.95 , pp. 021905
- Cho, M.G.¹ Kim, H.Y.² Seo, S.K.³ Lee, H.M.⁴

21
- 79751538232
- J. Wang, C. Liu, C. Leinenbach, U.E. Klotz, P.J. Uggowitzer, and J.F. Loffler Calphad: Comput. Coupling Phase Diagrams Thermochem. 35 2011 82
- (2011) Calphad: Comput. Coupling Phase Diagrams Thermochem. , vol.35 , pp. 82
- Wang, J.¹ Liu, C.² Leinenbach, C.³ Klotz, U.E.⁴ Uggowitzer, P.J.⁵ Loffler, J.F.⁶

22
- 67349246461
- X. Zhang, Y. Zhan, Q. Guo, G. Zhang, and J. Hu J. Alloys Compd. 480 2009 382
- (2009) J. Alloys Compd. , vol.480 , pp. 382
- Zhang, X.¹ Zhan, Y.² Guo, Q.³ Zhang, G.⁴ Hu, J.⁵

23
- 0033807425
- H. Kleinke, M. Waldeck, and P. Gutlich Chem. Mater. 12 2000 2219
- (2000) Chem. Mater. , vol.12 , pp. 2219
- Kleinke, H.¹ Waldeck, M.² Gutlich, P.³

24
- 0033819451
- B.B. Alchagirov, and A.M. Chochaeva High Temp. 38 2000 44
- (2000) High Temp. , vol.38 , pp. 44
- Alchagirov, B.B.¹ Chochaeva, A.M.²

25
- 3042949978
- C. Coston, and N.H. Nachtrieb J. Phys. Chem. 68 1964 2219
- (1964) J. Phys. Chem. , vol.68 , pp. 2219
- Coston, C.¹ Nachtrieb, N.H.²

* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.