NiSn 4 formation during the solidification of Sn-Ni alloys

Intermetallics

Volumn 25, Issue , 2012, Pages 48-59

  Belyakov, S A ^a   Gourlay, C M ^a  

^a IMPERIAL COLLEGE LONDON   (United Kingdom)

Author keywords

A. Intermetallics; B. Phase transformation; B. Thermal stability; C. Crystal growth; D. Microstructure

Indexed keywords

COOLING RATES; EUTECTIC PHASE; GROWTH DIRECTIONS; INTERFACE PLANES; ORIENTATION RELATIONSHIP; SN-NI ALLOY; SOLIDIFICATION CONDITION; SOLIDIFICATION TEMPERATURE;

CRYSTAL GROWTH; CRYSTAL STRUCTURE; EUTECTICS; GROWTH KINETICS; INTERMETALLICS; PHASE TRANSITIONS; THERMODYNAMIC STABILITY; TIN;

SOLIDIFICATION;

EID: 84858144262     PISSN: 09669795     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.intermet.2012.02.010     Document Type: Article

References (37)

1. C. Schmetterer, H. Flandorfer, K.W. Richter, U. Saeed, M. Kauffman, and P. Roussel A new investigation of the system Ni-Sn Intermetallics 15 7 2007 869 884
2. C. Lea A scientific guide to surface mount technology 1988 Electrochemical publications limited Ayr 333
3. A.C. Harman Rapid tin-nickel intermetallic growth: some effects on solderability 1978 Standard Telecomunication Laboratories Harlow
4. P.J. Kay, and C.A. Mackay The growth of intermetallic compounds on common basis materials coated with tin and tin-lead alloys Transactions of the Institution of Metal Finishing 54 1977 68 74
5. J. Haimovich Intermetallic compound growth in tin and tin-lead platings over nickel and its effects on solderability Welding Journal 68 3 1989 S102 S111
6. C.M. Chen, and S.W. Chen Electromigration effects upon the low-temperature Sn/Ni interfacial reactions Journal of Materials Research 18 6 2003 1293 1296
7. W.K. Choi, and H.M. Lee Effect of Ni layer thickness and soldering time on intermetallic compound formation at the interface between molten Sn-3.5Ag and Ni/Cu substrate Journal of Electronic Materials 28 11 1999 1251 1255
8. I. Vitina, I. Pelece, V. Rubene, V. Belmane, M. Lubane, and A. Krumina Formation of intermediate intermetallic layers on interaction of electrodeposited Sn, Ni-Fe, Ni-B coatings with different metallic substrata Journal of Adhesion Science and Technology 11 6 1997 835 860
9. C.H. Wang, C.Y. Kuo, H.H. Chen, and S.W. Chen Effects of current density and temperature on Sn/Ni interfacial reactions under current stressing Intermetallics 19 1 2011 75 80
10. L.J. Zhang, L. Wang, X.M. Xie, and W. Kempe An investigation on thermal reliability of underfilled PBGA solder joints 5th International IEEE Symposium on high density packaging and Component Failure analysis 2002 Ieee-Inst Electrical Electronics Engineers Inc Shanghai, Peoples R China
11. W.J. Boettinger, M.D. Vaudin, M.E. Williams, L.A. Bendersky, and W.R. Wagner Electron backscattered diffraction and energy dispersive X-ray spectroscopy study of the phase NiSn4 Journal of Electronic Materials 32 6 2003 511 515
12. W. Riesenkampf, T. Biestek, J. Morgiel, and W. Lasocha New high-tin phase found in electrolytic Sn-Ni deposits Journal of Materials Science 36 19 2001 4633 4636
13. O. Yukinori, and K. Masayuki IMC growth Study on Ni-P/Pd/Au Film and Ni-P/Au film using Sn/Ag/Cu lead-free solder Uyemura Technical Reports Journal 59 2006
14. T. Watanabe, K. Arai, T. Hirose, and M. Chikazawa Relationship between crystallographic structure of electroplated Ni-Sn alloy film and its thermal equilibrium diagram Journal of the Japan Institute of Metals 63 4 1999 489 495
15. G. Ghosh First-Principles Calculation of phase Stability and Cohesive Properties of Ni-Sn intermetallics Metallurgical and Materials Transactions A-Physical Metallurgy and Materials Science 40A 1 2009 4 23
16. Y.H. Chao, S.W. Chen, C.H. Chang, and C.C. Chen Phase equilibria of Sn-Co-Ni system and interfacial reactions in Sn/(Co, Ni) couples Metallurgical and Materials Transactions A-Physical Metallurgy and Materials Science 39A 3 2008 477 489
17. T. Ventura, C.M. Gourlay, K. Nogita, T. Nishimura, M. Rappaz, and A.K. Dahle The influence of 0-0.1 wt.% Ni on the microstructure and fluidity length of Sn-0.7Cu-xNi Journal of Electronic Materials 37 1 2008 32 39
18. A.T. Dinsdale, A. Watson, A. Kroupa, J. Vrestal, A. Zemanova, and J. Vizdal Atlas of phase diagrams for lead-free soldering. Action number: 531 vol. 1 2008 The European Science Foundation, and MTSOLDERS v.1.0 database at http://resource.npl.co.uk/mtdata/currentreleases.htm
19. W. Jeitschko, and B. Jaberg Structure Refinement of Ni3Sn4 Acta Crystallographica Section B-Structural Science 38 FEB 1982 598 600
20. H. Fjellvag, and A. Kjekshus Structural properties of Co3Sn2, Ni3Sn2 and some ternary derivatives Acta Chemica Scandinavica, Series A 40 1986 23 30
21. A.L. Lyubimtsev, A.I. Baranov, A. Fischer, L. Kloo, and B.A. Popovkin The structure and bonding of Ni3Sn Journal of Alloys and Compounds 340 1-2 2002 167 172
22. E.L. Nordmark, O. Wallner, and U. Haussermann Polymorphism of IrSn4 Journal of Solid State Chemistry 168 1 2002 34 40
23. U. Roesler, and K. Schubert Die Kristallstruktur von PtPb4 Zeitschrift Fuer Metallkunde 42 1951 395 400
24. M. Wolcyrz, R. Kubiak, and S. Maciejewski X-ray investigation of thermal expansion and atomic thermal vibrations of tin, indium and other alloys Physica Status Solidi B-Basic Research 107 1 1981 245 253
25. R. Elliott Eutectic solidification 1983 Butterworth, London
26. D. Qiu, M.X. Zhang, and P.M. Kelly Crystallography of heterogeneous nucleation of Mg grains on Al2Y nucleation particles in an Mg-10 wt.% Y alloy Scripta Materialia 61 3 2009 312 315
27. R.W. Kraft Crystallography ofequlibrium phase interfaces in Al-CuAl2 eutectic alloys Transactions AIME 224 1962 65
28. B.L. Bramfitt Effect of carbide and nitride additions on heterogeneous nucleation behaviour of liquid iron Metallurgical Transactions 1 7 1970 1987
29. C.M. Gourlay, C.M. Gourlay, K. Nogita, J. Read, and A.K. Dahle Intermetallic formation and fluidity in Sn-rich Sn-Cu-Ni alloys Journal of Electronic Materials 39 1 2010 56 69
30. R. Kubiak, and M. Wolcyrz X-ray investigations of crystallization and thermal expansion of AuSn4, PdSn4 and PtSn4 Journal of the Less-Common Metals 109 2 1985 339 344
31. J.A. Dantzig, and M. Rappaz Solidification 1st ed 2009 EPFL Press Lausanne
32. H. Okamoto T.B. Massalski, II Ed. Binary alloy phase diagrams vol. 3 1990
33. H. Okamoto Pt-Sn (platinum-tin) Journal of Phase Equilibria 24 2 2003 198
34. H. Okamoto Au-Sn (Gold-Tin) Journal of Phase Equilibria and Diffusion 28 5 2007 490
35. B. Labullie, and C. Petipas Crystallographic study of AuSn4-Sn eutectic alloy Scripta Metallurgica 12 1978 587 590
36. J.J. Favier, and M. Turpin Faceting and morphological regularity of eutectic structures: the AuSn4-Sn system Acta Metallurgica 27 6 1979 1021 1030
37. R. Kubiak The influence of temperature on the crystal structure of AuSn4 Journal of the Less-Common Metals 80 2 1981 P53 P58