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Journal of Alloys and Compounds

Volumn 527, Issue , 2012, Pages 226-232

Effects of Zn addition and aging treatment on tensile properties of Sn-Ag-Cu alloys

(4) Hamada, Naoyuki a Uesugi, Tokuteru b Takigawa, Yorinobu b Higashi, Kenji b

a Ishikawa Metal Co Ltd (Japan)

b Osaka Prefecture University (Japan)

Author keywords

Microstructure; Pb free solder; Scanning electron microscopy; X ray diffraction

Indexed keywords

AGING TREATMENT; ELEVATED TEMPERATURE; GROWTH OF INTERMETALLICS; PB FREE SOLDERS; SN-AG-CU ALLOY;

COPPER ALLOYS; LEAD; MICROSTRUCTURE; PLASTIC FLOW; SCANNING ELECTRON MICROSCOPY; SILVER; SILVER ALLOYS; SOLDERING ALLOYS; TIN; X RAY DIFFRACTION; ZINC; ZINC ALLOYS;

TIN ALLOYS;

EID: 84859556215 PISSN: 09258388 EISSN: None Source Type: Journal
DOI: 10.1016/j.jallcom.2012.03.008 Document Type: Article

Times cited : (42)

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