SCOPUS 정보 검색 플랫폼

Materials Science and Engineering: A

Volumn 527, Issue 10-11, 2010, Pages 2588-2591

Formation of Ag3Sn plates in SnAgCu solder bumps

(4) Gong, Jicheng a Liu, Changqing b Conway, Paul P b Silberschmidt, Vadim V b

a UNIVERSITY OF OXFORD (United Kingdom)

b LOUGHBOROUGH UNIVERSITY (United Kingdom)

Author keywords

Crystal growth; Intermetallics; Solder; Solidification

Indexed keywords

BINARY ALLOYS; COPPER ALLOYS; INTERMETALLICS; LEAD-FREE SOLDERS; SILVER ALLOYS; SOLDERING; TERNARY ALLOYS; TIN ALLOYS;

COOLING STAGE; DURING PHASE; FORMATION PROCESS; GROWTH DIRECTIONS; LIQUID SOLDERS; PHASES TRANSFORMATION; PLATE-OUT; SNAGCU SOLDER; SOLDER BUMP; SOLID REACTANTS;

FLIP CHIP DEVICES;

EID: 77249089395 PISSN: 09215093 EISSN: None Source Type: Journal
DOI: 10.1016/j.msea.2009.12.020 Document Type: Article

Times cited : (31)

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* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.