A compliant and creep resistant SAC-Al(Ni) alloy

Proceedings of the Electronic Packaging Technology Conference, EPTC

Volumn , Issue , 2007, Pages 693-702

  Huang, Benlih ^a   Hwang, Hong Sik ^a   Lee, Ning Cheng ^a  

^a INDIUM CORPORATION   (United States)

Author keywords

Al; Compliant; Creep resistant; Lead free; Ni; SAC; Soften; Solder

Indexed keywords

ADDITION OF AL; ADDITION QUANTITY; AL; COMPLIANT; CREEP RATES; CREEP RESISTANT; ELONGATION AT BREAK; LEAD-FREE; LIQUIDUS TEMPERATURES; NI; NON-STOICHIOMETRIC; PACKAGING TECHNOLOGIES; SAC; SAC ALLOYS; SIGNIFICANT REDUCTION; SOFTEN; SOLDER; YIELD STRENGTHS;

ALLOYS; ALUMINUM; COPPER; CRACK PROPAGATION; CREEP; ELECTRONIC EQUIPMENT MANUFACTURE; ELECTRONICS PACKAGING; EUTECTICS; METALLIC COMPOUNDS; NICKEL; NICKEL ALLOYS; SEMICONDUCTING INTERMETALLICS; SILVER; TECHNOLOGY; YIELD STRESS;

SILVER ALLOYS;

EID: 50049107582     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/EPTC.2007.4469840     Document Type: Conference Paper

References (3)

1. Yoshiharu Kariya, Takuya Hosoi, Shinichi Terashima, Masamoto Tanaka, Masahisa Otsuka, "Effect of silver content on the shear fatigue properties of Sn-Ag-Cu flip-chip interconnects", Journal of electronic materials , vol. 33, no. 4, 2004, p. 321-328
2. S. K. Kang, P. A. Lauro, D. Y. Shih, D. W. Henderson, and K. J. Puttlitz, "Microstructure and mechanical properties of lead-free solders and solder joints used in microelectronic applications", IBM Journal of Research ad Development, on-line publication: http:/researchweb.watson.ibm.com/journal/rd/4 94/kang.html
3. Masazumi Amagai (Texas Instruments, Japan), " A Study of Nano Particles in SnAg-Based Lead Free Solders for Intermetallic Compounds and Drop Test Performance", 56th ECTC Proceedings, P. 1170-1190, San Diego, CA, May 30-June 2, 2006