Reliability studies of Sn-9Zn/Cu and Sn-9Zn-0.06Nd/Cu joints with aging treatment

Materials and Design

Volumn 34, Issue , 2012, Pages 768-775

  Hu, Yu hua ^a   Xue, Song bai ^a   Ye, Huan ^a   Xiao, Zheng xiang ^a   Gao, Li li ^a   Zeng, Guang ^a  

^a NANJING UNIVERSITY OF AERONAUTICS AND ASTRONAUTICS   (China)

Author keywords

[No Author keywords available]

Indexed keywords

AGING TIME; AGING TREATMENT; CONSTANT TEMPERATURE; INTERMETALLIC COMPOUND LAYER; PULL STRENGTH; SN GRAINS;

AGGLOMERATION; BRITTLE FRACTURE; DUCTILE FRACTURE; INTERMETALLICS; MICROSTRUCTURE; NEODYMIUM; SOLDERED JOINTS; SOLDERING ALLOYS; TENSILE STRENGTH; ZINC;

TIN;

EID: 82455167787     PISSN: 02641275     EISSN: 18734197     Source Type: Journal    
DOI: 10.1016/j.matdes.2011.06.067     Document Type: Article

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