Formation of intermetallic compounds at eutectic Sn–Zn–Al solder/Cu interface

Journal of Materials Research

Volumn 16, Issue 1, 2001, Pages 76-82

  Yu, Shan Pu ^a   Wang, Moo Chin ^b   Hon, Min Hsiung ^a  

^a NATIONAL CHENG KUNG UNIVERSITY   (Taiwan)

^b NATIONAL KAOHSIUNG UNIVERSITY OF APPLIED SCIENCES   (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

ADHESION; CRYSTAL GROWTH; ELECTRON DIFFRACTION; EUTECTICS; HEAT TREATMENT; INTERFACES (MATERIALS); SCANNING ELECTRON MICROSCOPY; SOLDERING ALLOYS; SUBSTRATES; THERMODYNAMICS; TIN ALLOYS; TRANSMISSION ELECTRON MICROSCOPY;

ADHESION STRENGTH;

INTERMETALLICS;

EID: 0035239686     PISSN: 08842914     EISSN: None     Source Type: Journal    
DOI: 10.1557/JMR.2001.0015     Document Type: Article

References (23)

1. The relevancy of current environmental issues to solder joints in microelectronic applications