Heat resistance of Sn-9Zn solder/Cu interface with or without coating

Journal of Materials Research

Volumn 15, Issue 4, 2000, Pages 884-891

  Suganuma, Katsuaki ^a   Murata, Toshikazu ^b   Noguchi, Hiroji ^c   Toyoda, Yoshitaka ^d  

^a OSAKA UNIVERSITY   (Japan)

^b Toyohashi Sozo College   (Japan)

^c PANASONIC CORPORATION   (Japan)

^d SENJU METAL INDUSTRY CO LTD   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

COPPER; DEGRADATION; HEAT RESISTANCE; INORGANIC COATINGS; INTERFACES (MATERIALS); MORPHOLOGY; SEGREGATION (METALLOGRAPHY); SOLDERING ALLOYS; SUBSTRATES; TENSILE TESTING;

INTERFACIAL MORPHOLOGY;

TIN ALLOYS;

EID: 0034174578     PISSN: 08842914     EISSN: None     Source Type: Journal    
DOI: 10.1557/JMR.2000.0126     Document Type: Article

References (7)