Effects of rare earth element Nd on the solderability and microstructure of Sn-Zn lead-free solder

Journal of Materials Science: Materials in Electronics

Volumn 22, Issue 5, 2011, Pages 481-487

  Hu, Yu Hua ^a   Xue, Song Bai ^a   Wang, Hui ^a   Ye, Huan ^a   Xiao, Zheng Xiang ^a   Gao, Li Li ^a  

^a NANJING UNIVERSITY OF AERONAUTICS AND ASTRONAUTICS   (China)

Author keywords

[No Author keywords available]

Indexed keywords

LEAD FREE SOLDERS; PULL FORCE; SHEAR FORCE; SN-9ZN SOLDER; SN-ZN SOLDER; SOLDER JOINTS; SOLDER MATRIX; SOLDERABILITY; TRACE AMOUNTS;

MECHANICAL PROPERTIES; MICROSTRUCTURE; NEODYMIUM; PHASE INTERFACES; RARE EARTHS; SOLDERED JOINTS; SOLDERING ALLOYS; TRACE ELEMENTS; ZINC;

TIN;

EID: 79954429000     PISSN: 09574522     EISSN: 1573482X     Source Type: Journal    
DOI: 10.1007/s10854-010-0163-2     Document Type: Article

References (18)

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