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Volumn 45, Issue 3, 2004, Pages 734-740
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Influence of the interfacial reaction layer on reliability of CSP joints using Sn-8Zn-3Bi solder and Ni/Au plating
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Author keywords
Chip size package (CSP) assembly; Joint reliability; Lead free solder; Nickel gold plating
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Indexed keywords
BOND STRENGTH (MATERIALS);
DELAMINATION;
DIFFUSION;
EUTECTICS;
GOLD PLATING;
MICROSTRUCTURE;
NICKEL PLATING;
PASSIVATION;
RELIABILITY;
SOLDERED JOINTS;
THERMAL EXPANSION;
CHIP SIZE PACKAGE (CSP);
JOINT RELIABILITY;
LEAD-FREE SOLDERS;
NICKEL/GOLD PLATING;
SOLDERING ALLOYS;
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EID: 2442585461
PISSN: 13459678
EISSN: None
Source Type: Journal
DOI: 10.2320/matertrans.45.734 Document Type: Article |
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Times cited : (20)
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References (7)
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