Effects of aging on structural evolution of the rapidly solidified Sn-Ag-Zn eutectic solder

Journal of Alloys and Compounds

Volumn 468, Issue 1-2, 2009, Pages 154-157

  Wei, Chen ^a   Liu, Yongchang ^a   Gao, Zhiming ^a   Xu, Ronglei ^a   Yang, Kai ^a  

^a TIANJIN UNIVERSITY   (China)

Author keywords

Aging; Intermetallics; Lead free solder; Microhardness; Microstructure

Indexed keywords

BRAZING; COARSENING; EUTECTICS; INTERMETALLICS; LEAD; MICROHARDNESS; MICROSTRUCTURE; RAPID SOLIDIFICATION; SEMICONDUCTING INTERMETALLICS; SILVER; SILVER ALLOYS; SOLDERED JOINTS; SOLDERING ALLOYS; STABILITY; TERNARY SYSTEMS; WELDING; ZINC;

A STABLES; AGING; EUTECTIC SOLDERS; INTERMETALLIC COMPOUNDS; LEAD-FREE SOLDER; RAPIDLY SOLIDIFIED; ROOM TEMPERATURES; SLOWLY COOLED; STRUCTURAL EVOLUTIONS; STRUCTURAL STABILITIES; SYSTEM ENERGIES;

TIN;

EID: 58049191312     PISSN: 09258388     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.jallcom.2008.01.019     Document Type: Article

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