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Materials Chemistry and Physics

Volumn 115, Issue 1, 2009, Pages 367-370

Effect of temperature on microstructural changes of the Sn-9 wt.% Zn lead-free solder stripe under current stressing

(4) Chen, Chih ming a Hung, Yu min a Lin, Chi pu a Su, Wen Chiung b

a NATIONAL CHUNG HSING UNIVERSITY (Taiwan)

b CHUNG SHAN INSTITUTE OF SCIENCE AND TECHNOLOGY (Taiwan)

Author keywords

Alloys; Electronic materials; Microstructure; Precipitation

Indexed keywords

BRAZING; COOLING; ELECTROMIGRATION; FURNACES; LEAD; MICROSTRUCTURE; PRECIPITATION (CHEMICAL); THERMAL EFFECTS; TIN ALLOYS; WELDING; ZINC;

A DENSITIES; CATHODE AND ANODES; COOLING CONDITIONS; CU ELECTRODES; CURRENT-STRESSING; EFFECT OF TEMPERATURES; ELECTROMIGRATION BEHAVIORS; ELECTRONIC MATERIALS; LEAD-FREE SOLDERS; MICRO-STRUCTURAL CHANGES; PRECIPITATION; SN-9WT.%ZN; SN-ZN SOLDERS; SOLDER STRIPES;

TIN;

EID: 60949113923 PISSN: 02540584 EISSN: None Source Type: Journal
DOI: 10.1016/j.matchemphys.2008.12.019 Document Type: Article

Times cited : (25)

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