Investigation on properties of Ga to Sn-9Zn lead-free solder

Journal of Materials Science: Materials in Electronics

Volumn 21, Issue 5, 2010, Pages 496-502

  Chen, Wenxue ^a   Xue, Songbai ^a   Wang, Hui ^a   Wang, Jianxin ^a   Han, Zongjie ^a  

^a NANJING UNIVERSITY OF AERONAUTICS AND ASTRONAUTICS   (China)

Author keywords

[No Author keywords available]

Indexed keywords

BRITTLE FAILURES; GA CONTENT; LEAD FREE SOLDERS; LIQUIDUS TEMPERATURE; MELTING BEHAVIOR; PULL FORCE; SOLDERABILITY; SOLIDUS TEMPERATURE; UNIFORM MICROSTRUCTURE;

DUCTILE FRACTURE; GALLIUM; GALLIUM ALLOYS; LEAD; MECHANICAL PROPERTIES; SURFACE TENSION; TIN ALLOYS; ZINC;

TIN;

EID: 77953321946     PISSN: 09574522     EISSN: 1573482X     Source Type: Journal    
DOI: 10.1007/s10854-009-9945-9     Document Type: Article

References (15)

1. T.C. Hsuan, K.L. Lin, Microstructural evolution of ε-AgZn3 and η-Zn phases in Sn-8.5Zn-0.5Ag-0.01Al-0.1Ga solder during aging treatment. J. Alloy. Compd. 409, 350-356 (2009)
2. X. Chen, A.M. Hu, M. Li, D.L. Mao, Effect of a trace of Cr on intermetallic compound layer for tin-zinc lead-free solder joint during aging. J. Alloy. Compd. 470, 429-433 (2009)
3. C.M. Chen, Y.M. Hung, C.P. Lin, W.C. Su, Effect of temperature on microstructural changes of the Sn-9wt.% Zn lead-free solder stripe under current stressing. Mater. Chem. Phys. 115, 367-370 (2009)
4. C. Wei, Y.C. Liu, Z.M. Gao et al., Thermodynamic properties and phase equilibria of Sn-Bi-Zn ternary alloys. J. Alloy. Compd. 468, 154-157 (2009)
5. C. Wei, Y.C. Liu, Z.M. Gao et al., Effects of small addition of In on the structure of the rapidly cooled Sn-Ag-Zn solder. J. Alloy. Compd. 470, 145-149 (2009)
6. R. Mahmudi, A.R. Geranmayeh, H. Noori, M. Shahabi, Impression creep of hypoeutectic Sn-Zn lead-free solder alloys. Mater. Sci. Eng. A 491, 110-116 (2008)
7. R. Mahmudi, A.R. Geranmayeh, H. Khanbareh et al., Indentation creep of lead-free Sn-9Zn and Sn-8Zn-3Bi solder alloys. Mater. Des. 30, 574-580 (2009)
8. C.K. Behera, M. Shamsuddin, Thermodynamic investigations of Sn-Zn-Ga liquid solutions. Thermochim. Acta 487, 18-25 (2009)
9. C.F. Yang, F.L. Chen, W. Gierlotka, Thermodynamic properties and phase equilibria of Sn-Bi-Zn ternary alloys. Mater. Chem. Phys 112, 94-103 (2008)
10. N.S. Liu, K.L. Lin, Evolution of interfacial morphology of Sn-8.5Zn-0.5Ag-0.1Al-xGa/Cu system during isothermal aging. J. Alloy. Compd. 456, 466-473 (2008)
11. K.L. Lin, T.P. Liu, High temperature oxidation of a Sn-Zn-Al Solder. Oxid. Met. 50, 255-267 (1998)
12. X. Chen, A.M. Hu, M. Li, D.L. Mao, Study on the properties of Sn-9Zn-xCr lead-free solder. J. Alloy. Compd. 460, 478-484 (2008)
13. S. Vaynman, M.E. Fine, Development of fluxes for lead-free solders containing zinc. Scripta Mater. 41, 1269-1271 (1999)
14. N.S. Liu, K.L. Lin, The effect of Ga content on the wetting reaction and interfacial morphology formed between Sn-8.55Zn-0.5Ag-0.1Al-xGa solders and Cu. Scripta Mater. 54, 219-224 (2006)
15. Z.J. Han, S.B. Xue, J.X. Wang et al., Mechanical properties of QFP micro-joints soldered with lead-free solders using diode laser soldering technology. Trans. Nonferrous Met. Soc. China 18, 814-818 (2008)