Indentation creep of lead-free Sn-9Zn and Sn-8Zn-3Bi solder alloys

Materials and Design

Volumn 30, Issue 3, 2009, Pages 574-580

  Mahmudi, R ^a   Geranmayeh, A R ^b   Khanbareh, H ^a   Jahangiri, N ^a  

^a UNIVERSITY OF TEHRAN   (Iran)

^b ISLAMIC AZAD UNIVERSITY   (Iran)

Author keywords

E.Creep; Mechanical

Indexed keywords

CREEP BEHAVIORS; CREEP RESPONSES; E.CREEP; INDENTATION CREEPS; INDENTATION TESTS; LEAD-FREE; MECHANICAL; METHODS OF ANALYSIS; SN-8ZN-3BI; SOLDER ALLOYS; STRESS EXPONENTS;

ALLOYS; BRAZING; CREEP; CREEP RESISTANCE; LEAD; LEAD ALLOYS; METALLIC COMPOUNDS; PRECIPITATION (CHEMICAL); SOLDERING ALLOYS; TIN ALLOYS; TITANIUM COMPOUNDS; WELDING; ZINC;

TIN;

EID: 57149104928     PISSN: 02641275     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.matdes.2008.05.058     Document Type: Article

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