SCOPUS 정보 검색 플랫폼

Scripta Materialia

Volumn 40, Issue 3, 1999, Pages 327-332

Interfacial reaction between Sn-1Bi-5In-9Zn solder and Cu substrate

(3) Yoon, Seung Wook a Choi, Won Kyoung b Lee, Hyuck Mo b

a Device Research 2nd Department (South Korea)

b Korea Advanced Institute of Science and Technology (KAIST) (South Korea)

Author keywords

[No Author keywords available]

Indexed keywords

ACTIVATION ENERGY; AGING OF MATERIALS; BRASS; COPPER; ELECTRIC CONDUCTIVITY OF SOLIDS; INTERFACES (MATERIALS); INTERMETALLICS; MORPHOLOGY; SHEAR STRENGTH; SOLDERED JOINTS; THERMAL CONDUCTIVITY OF SOLIDS; THERMAL EFFECTS;

INTERFACIAL REACTIONS;

TIN ALLOYS;

EID: 0033534274 PISSN: 13596462 EISSN: None Source Type: Journal
DOI: 10.1016/S1359-6462(98)00414-X Document Type: Article

Times cited : (39)

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