The effect of Ga content on the wetting reaction and interfacial morphology formed between Sn-8.55Zn-0.5Ag-0.1Al-xGa solders and Cu

Scripta Materialia

Volumn 54, Issue 2, 2006, Pages 219-224

  Liu, Nai Shuo ^a   Lin, Kwang Lung ^a  

^a NATIONAL CHENG KUNG UNIVERSITY   (Taiwan)

Author keywords

Activation energy; Interfacial morphology; Surface tension; Wettability

Indexed keywords

ACTIVATION ENERGY; GALLIUM; SOLDERING; SURFACE TENSION; WETTING;

WETTABILITY; WETTING ANGLE; WETTING REACTION;

TIN ALLOYS;

EID: 27644553870     PISSN: 13596462     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.scriptamat.2005.09.033     Document Type: Article

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