Multi-scale modeling of the viscoplastic response of as-fabricated microscale Pb-free Sn3.0Ag0.5Cu solder interconnects

Acta Materialia

Volumn 58, Issue 18, 2010, Pages 5989-6001

  Cuddalorepatta, Gayatri ^a   Dasgupta, Abhijit ^a  

^a UNIVERSITY OF MARYLAND   (United States)

Author keywords

Creep; Dislocation climb; Homogenisation; Lead free solder; Micromechanics

Indexed keywords

CREEP; HOMOGENIZATION METHOD; LEAD; MICROMECHANICS; MICROSTRUCTURAL EVOLUTION; SOLDERED JOINTS; SOLDERING ALLOYS; TIN; TIN ALLOYS;

DESIGN AND OPTIMIZATION; DISLOCATION CLIMB; DISPERSION STRENGTHENING; GRAIN MICROSTRUCTURE; HOMOGENIZATION SCHEME; INTERMETALLIC PHASIS; MICROSTRUCTURAL FEATURES; VISCOPLASTIC RESPONSE;

LEAD-FREE SOLDERS;

EID: 80052715017     PISSN: 13596454     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.actamat.2010.07.016     Document Type: Article

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