Dislocation activity and slip analysis contributing to grain boundary sliding and damage during thermomechanical fatigue in dual shear lead-free solder joint specimens

Solid State Phenomena

Volumn 105, Issue , 2005, Pages 219-226

  Telang, A U ^a   Bieler, T R ^a  

^a Michigan State University   (United States)

Author keywords

Lead free solder; OIM; Schmid factor; Thermomechanical Fatigue (TMF)

Indexed keywords

DEFORMATION; DISLOCATIONS (CRYSTALS); GRAIN BOUNDARIES; LEAD; MICROSTRUCTURE; NUCLEATION; SCANNING ELECTRON MICROSCOPY; SOLDERED JOINTS; THERMAL EXPANSION;

LEAD-FREE SOLDER; OIM; SCHMID FACTOR; THERMOMECHANICAL FATIGUE (TMF);

FATIGUE OF MATERIALS;

EID: 19344378699     PISSN: 10120394     EISSN: None     Source Type: Book Series    
DOI: 10.4028/www.scientific.net/ssp.105.219     Document Type: Conference Paper

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