Prediction of rate-dependent constitutive behavior of Pb-free solders

American Society of Mechanical Engineers, Electronic and Photonic Packaging, EPP

Volumn 3, Issue , 2003, Pages 209-214

  Zhang, Qian ^a   Sharma, Pradeep ^a   Dasgupta, Abhijit ^a  

^a UNIVERSITY OF MARYLAND   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CREEP; DISLOCATIONS (CRYSTALS); GRAIN BOUNDARIES; GRAIN SIZE AND SHAPE; LEAD; MICROSTRUCTURE; PARAMETER ESTIMATION; PARTICLE SIZE ANALYSIS; STRAIN RATE;

CONSTITUTIVE PROPERTIES; STEADY-STATE CREEP;

SOLDERING ALLOYS;

EID: 1942504771     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1115/IMECE2003-41774     Document Type: Conference Paper

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