Correlation between localized strain and damage in shear-loaded Pb-free solders

Microelectronics Reliability

Volumn 47, Issue 8, 2007, Pages 1262-1272

  Matin, M A ^a   Theeven, J G A ^a   Vellinga, W P ^a   Geers, M G D ^a  

^a EINDHOVEN UNIVERSITY OF TECHNOLOGY   (Netherlands)

Author keywords

[No Author keywords available]

Indexed keywords

ALGORITHMS; GRAIN BOUNDARIES; MICROSTRUCTURE; STRAIN MEASUREMENT; TIN ALLOYS;

DIGITAL IMAGE CORRELATION; LOCAL STRAIN; SOLDER ALLOYS;

SOLDERING ALLOYS;

EID: 34547217001     PISSN: 00262714     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.microrel.2006.09.025     Document Type: Article

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