Effect of Ag and Cu concentrations on the creep behavior of Sn-based solders

Journal of Electronic Materials

Volumn 37, Issue 3, 2008, Pages 347-354

  Chen, T ^a   Dutta, I ^a  

^a Naval Postgraduate School ^*  (United States)

Author keywords

Copper; Impression creep; Lead free solder; Silver; Tin

Indexed keywords

CREEP BEHAVIOR; DISLOCATION CLIMB; IMPRESSION CREEP; LEAD-FREE SOLDER;

COPPER; EUTECTICS; TIN;

SILVER;

EID: 38349095094     PISSN: 03615235     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11664-007-0340-0     Document Type: Article

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