Prediction of Rate-Independent Constitutive Behavior of Pb-Free Solders Based on First Principles

IEEE Transactions on Components and Packaging Technologies

Volumn 26, Issue 3, 2003, Pages 659-666

  Sharma, P ^a   Ganti, S ^a   Dasgupta, A ^a   Loman, J ^b  

^a GENERAL ELECTRIC COMPANY   (United States)

^b UNIVERSITY OF MARYLAND   (United States)

Author keywords

Heterogeneous alloys; Hybrid; NEMT; Pb free solders; Physical model; Plastic slip; Viscoplastic materials; Volume fractions

Indexed keywords

COMPOSITE MICROMECHANICS; GRAIN SIZE AND SHAPE; PARTICLE SIZE ANALYSIS; SOLDERING ALLOYS; VISCOPLASTICITY;

HETEROGENEOUS ALLOYS;

ELECTRONICS PACKAGING;

EID: 0142165071     PISSN: 15213331     EISSN: None     Source Type: Journal    
DOI: 10.1109/TCAPT.2003.817861     Document Type: Article

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