Multiscale analysis of microstructural evolution and degradation in solder alloys

International Journal for Multiscale Computational Engineering

Volumn 5, Issue 2, 2007, Pages 93-103

  Geers, Marc G D ^a   Ubachs, R L J M ^a   Erinc, M ^a   Matin, M A ^a   Schreurs, P J G ^a   Vellinga, W P ^a  

^a EINDHOVEN UNIVERSITY OF TECHNOLOGY   (Netherlands)

Author keywords

Coarsening; Cohesive zone; Damage; Failure; Interconnects; Interfacial fracture; Metallization layer; Multiscale; Orientation imaging microscopy; Solder alloys; Thermal anisotropy

Indexed keywords

ANISOTROPY; COMPUTATIONAL METHODS; DEGRADATION; DIFFUSION; FREE ENERGY; MICROELECTRONICS; MICROSTRUCTURAL EVOLUTION; RELIABILITY ANALYSIS; VISCOPLASTICITY;

COHESIVE ZONES; INTERCONNECTS; INTERFACIAL FRACTURE; METALLIZATION LAYERS; ORIENTATION IMAGING MICROSCOPY; SOLDER ALLOYS; THERMAL ANISOTROPY;

SOLDERING ALLOYS;

EID: 34548401603     PISSN: 15431649     EISSN: None     Source Type: Journal    
DOI: 10.1615/IntJMultCompEng.v5.i2.30     Document Type: Article

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