Intergranular thermal fatigue damage evolution in SnAgCu lead-free solder

Mechanics of Materials

Volumn 40, Issue 10, 2008, Pages 780-791

  Erinc, M ^a   Schreurs, P J G ^a   Geers, M G D ^a  

^a EINDHOVEN UNIVERSITY OF TECHNOLOGY   (Netherlands)

Author keywords

Cohesive zone modeling; Lead free solder; Thermal fatigue

Indexed keywords

AGRICULTURAL PRODUCTS; ARSENIC; BRAZING; COATING TECHNIQUES; CRYSTAL GROWTH; CRYSTALLOGRAPHY; ELASTIC MODULI; ELECTRIC CURRENTS; ELECTRONIC EQUIPMENT MANUFACTURE; ELECTRONICS INDUSTRY; EVOLUTIONARY ALGORITHMS; FATIGUE OF MATERIALS; GRAIN (AGRICULTURAL PRODUCT); GRAIN BOUNDARIES; LEAD; LITHOGRAPHY; METALS; MICROSTRUCTURAL EVOLUTION; MICROSTRUCTURE; MORPHOLOGY; PHASE BOUNDARIES; SEPARATION; SOLDERED JOINTS; SOLDERING; SULFATE MINERALS; TESTING; THERMAL FATIGUE; TIN ALLOYS; WELDING;

(PL) PROPERTIES; APPLIED (CO); COHESIVE ZONE (CZ); COMPONENT SIZE; DAMAGE EVOLUTION; DAMAGE MECHANISMS; DAMAGE VARIABLES; ELASTICITY MODULUS; ELSEVIER (CO); FATIGUE DAMAGE EVOLUTION; FATIGUE LIFE PREDICTIONS; FATIGUE LOADINGS; FATIGUE RESPONSE; GRAIN ORIENTATIONS; INTERFACIAL INTERACTIONS; INTERGRANULAR; LEAD-FREE SOLDER (SN-3.5AG-0.5CU); LOCALIZED DEFORMATIONS; LOW STRAINS; MECH ANICAL FATIGUE; MECHANICAL DEGRADATION; MISMATCH FACTORS; NUMBER OF CYCLES; NUMERICAL EXAMPLES; SN-AG-CU SOLDER; SOLDER BALLS; TEMPERATURE CYCLING; TEST SPECIMENS; TRACTION SEPARATION;

FATIGUE DAMAGE;

EID: 45849133746     PISSN: 01676636     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.mechmat.2008.04.005     Document Type: Article

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