-
1
-
-
3142680352
-
Microstructural evolution in lead-free solder alloys: Part I. cast Sn-Ag-Cu eutectic
-
Allen S., Notis M., Chromik R., and Vinci R. Microstructural evolution in lead-free solder alloys: Part I. cast Sn-Ag-Cu eutectic. Journal of Materials Research 19 5 (2004) 1417-1424
-
(2004)
Journal of Materials Research
, vol.19
, Issue.5
, pp. 1417-1424
-
-
Allen, S.1
Notis, M.2
Chromik, R.3
Vinci, R.4
-
2
-
-
3142733011
-
Microstructural evolution in lead-free solder alloys: Part II. directionally solidified eutectic Sn-Ag-Cu, Sn-Cu and Sn-Ag alloys
-
Allen S., Notis M., Chromik R., and Vinci R. Microstructural evolution in lead-free solder alloys: Part II. directionally solidified eutectic Sn-Ag-Cu, Sn-Cu and Sn-Ag alloys. Journal of Materials Research 19 5 (2004) 1425-1431
-
(2004)
Journal of Materials Research
, vol.19
, Issue.5
, pp. 1425-1431
-
-
Allen, S.1
Notis, M.2
Chromik, R.3
Vinci, R.4
-
3
-
-
0036603885
-
Mechanical characterization of Sn-Ag-based lead-free solders
-
Amagai M., Watanabe M., Omiya M., Kishimoto K., and Shibuya T. Mechanical characterization of Sn-Ag-based lead-free solders. Microelectronics Reliability 42 (2002) 951-966
-
(2002)
Microelectronics Reliability
, vol.42
, pp. 951-966
-
-
Amagai, M.1
Watanabe, M.2
Omiya, M.3
Kishimoto, K.4
Shibuya, T.5
-
4
-
-
0024029187
-
Nonlocal continuum damage, localization instability and convergence
-
Bažant Z., and Pijaudier-Cabot G. Nonlocal continuum damage, localization instability and convergence. Journal of Applied Mechanics 55 (1988) 287-293
-
(1988)
Journal of Applied Mechanics
, vol.55
, pp. 287-293
-
-
Bažant, Z.1
Pijaudier-Cabot, G.2
-
5
-
-
24644493676
-
Anisotropic plasticity and cavity growth during upset forging of Ti-6Al-4V
-
Bieler T., Goetz R., and Semiatin S. Anisotropic plasticity and cavity growth during upset forging of Ti-6Al-4V. Materials Science and Engineering A 405 1-2 (2005) 201-213
-
(2005)
Materials Science and Engineering A
, vol.405
, Issue.1-2
, pp. 201-213
-
-
Bieler, T.1
Goetz, R.2
Semiatin, S.3
-
7
-
-
0000303559
-
Distribution of stresses and elastic strain energy in an ideal multicrystal model
-
Chen C., and Li S. Distribution of stresses and elastic strain energy in an ideal multicrystal model. Materials Science and Engineering A 257 2 (1998) 312-321
-
(1998)
Materials Science and Engineering A
, vol.257
, Issue.2
, pp. 312-321
-
-
Chen, C.1
Li, S.2
-
9
-
-
0011112253
-
On the numerical modelling of ductile damage with an implicit gradient-enhanced formulation
-
Geers M., Ubachs R., and Engelen R. On the numerical modelling of ductile damage with an implicit gradient-enhanced formulation. Revue Européenne des Eléments Finis 10 2/3/4 (2001) 173-192
-
(2001)
Revue Européenne des Eléments Finis
, vol.10
, Issue.2-3 -4
, pp. 173-192
-
-
Geers, M.1
Ubachs, R.2
Engelen, R.3
-
12
-
-
0035008111
-
Creep behavior in cu and ag particle-reinforced composite and eutectic Sn-3.5Ag and Sn-4.0Ag-0.5Cu non-composite solder joints
-
Guo F., Lucas J., and Subramanian K. Creep behavior in cu and ag particle-reinforced composite and eutectic Sn-3.5Ag and Sn-4.0Ag-0.5Cu non-composite solder joints. Journal of Materials Science: Materials in Electronics 12 (2001) 27-35
-
(2001)
Journal of Materials Science: Materials in Electronics
, vol.12
, pp. 27-35
-
-
Guo, F.1
Lucas, J.2
Subramanian, K.3
-
14
-
-
16544377116
-
Experimental and finite element analysis of the shear speed effects on the Sn-Ag and Sn-Ag-Cu BGA solder joints
-
Kim J., and Jung S. Experimental and finite element analysis of the shear speed effects on the Sn-Ag and Sn-Ag-Cu BGA solder joints. Materials Science and Engineering A 371 (2004) 267-276
-
(2004)
Materials Science and Engineering A
, vol.371
, pp. 267-276
-
-
Kim, J.1
Jung, S.2
-
15
-
-
0036680482
-
Effects of cooling speed on microstructure and tensile properties
-
Kim K., Huh S., and Suganuma K. Effects of cooling speed on microstructure and tensile properties. Materials Science and Engineering A 333 (2002) 106-114
-
(2002)
Materials Science and Engineering A
, vol.333
, pp. 106-114
-
-
Kim, K.1
Huh, S.2
Suganuma, K.3
-
16
-
-
0037463944
-
Effects of intermetallic compounds on properties of Sn-Ag-Cu lead-free soldered joints
-
Kim K., Huh S., and Suganuma K. Effects of intermetallic compounds on properties of Sn-Ag-Cu lead-free soldered joints. Journal of Alloys and Compounds 352 1-2 (2003) 226-236
-
(2003)
Journal of Alloys and Compounds
, vol.352
, Issue.1-2
, pp. 226-236
-
-
Kim, K.1
Huh, S.2
Suganuma, K.3
-
17
-
-
11344269855
-
Mechanical properties of near-eutectic Sn-Ag-Cu alloy over a wide range of temperatures and strain rates
-
Korhonen T., Turpeinen P., and Lehman L. Mechanical properties of near-eutectic Sn-Ag-Cu alloy over a wide range of temperatures and strain rates. Journal of Electronic Materials 33 12 (2004) 1581-1588
-
(2004)
Journal of Electronic Materials
, vol.33
, Issue.12
, pp. 1581-1588
-
-
Korhonen, T.1
Turpeinen, P.2
Lehman, L.3
-
18
-
-
1642337328
-
Design for lead-free solder joint reliability of high-density packages
-
Lau J., Dauksher W., Smetana J., and Horsley R. Design for lead-free solder joint reliability of high-density packages. Soldering & Surface Mount Technology 16 1 (2004) 12-26
-
(2004)
Soldering & Surface Mount Technology
, vol.16
, Issue.1
, pp. 12-26
-
-
Lau, J.1
Dauksher, W.2
Smetana, J.3
Horsley, R.4
-
19
-
-
19944429204
-
Growth of Sn and intermetallic compounds in Sn-Ag-Cu solder
-
Lehman L., Athavale S., and Fullem T. Growth of Sn and intermetallic compounds in Sn-Ag-Cu solder. Journal of Electronic Materials 33 12 (2004) 1429-1439
-
(2004)
Journal of Electronic Materials
, vol.33
, Issue.12
, pp. 1429-1439
-
-
Lehman, L.1
Athavale, S.2
Fullem, T.3
-
22
-
-
23144455436
-
Correlation between thermal fatigue and thermal anisotropy in a Pb-free solder alloy
-
Matin M., Coenen E., Vellinga W., and Geers M. Correlation between thermal fatigue and thermal anisotropy in a Pb-free solder alloy. Scripta Materialia 53 8 (2005) 927-932
-
(2005)
Scripta Materialia
, vol.53
, Issue.8
, pp. 927-932
-
-
Matin, M.1
Coenen, E.2
Vellinga, W.3
Geers, M.4
-
24
-
-
4344704701
-
Thermal cycling aging effects on Sn-Ag-Cu solder joint microstructure, IMC and strength
-
370-375
-
Pang J., Low T., Xiong B., Xu L., and Neo C. Thermal cycling aging effects on Sn-Ag-Cu solder joint microstructure, IMC and strength. Thin Solid Films (2004) 462-463 370-375
-
(2004)
Thin Solid Films
, pp. 462-463
-
-
Pang, J.1
Low, T.2
Xiong, B.3
Xu, L.4
Neo, C.5
-
26
-
-
0030267284
-
Gradient enhanced damage for quasi-brittle materials
-
Peerlings R., De Borst R., Brekelmans W., and de Vree J. Gradient enhanced damage for quasi-brittle materials. International Journal for Numerical Methods in Engineering 39 19 (1996) 3391-3403
-
(1996)
International Journal for Numerical Methods in Engineering
, vol.39
, Issue.19
, pp. 3391-3403
-
-
Peerlings, R.1
De Borst, R.2
Brekelmans, W.3
de Vree, J.4
-
28
-
-
2942699844
-
A thermodynamically motivated implicit gradient damage framework and its application to brick masonry cracking
-
Peerlings R., Massart T., and Geers M. A thermodynamically motivated implicit gradient damage framework and its application to brick masonry cracking. Computer Methods in Applied Mechanics and Engineering 193 30-32 (2004) 3403-3417
-
(2004)
Computer Methods in Applied Mechanics and Engineering
, vol.193
, Issue.30-32
, pp. 3403-3417
-
-
Peerlings, R.1
Massart, T.2
Geers, M.3
-
29
-
-
0027575692
-
On a class of constitutive equations in viscoplasticity: formulation and computational issues
-
Perić D. On a class of constitutive equations in viscoplasticity: formulation and computational issues. International Journal for Numerical Methods in Engineering 36 (1993) 1365-1393
-
(1993)
International Journal for Numerical Methods in Engineering
, vol.36
, pp. 1365-1393
-
-
Perić, D.1
-
30
-
-
33645016262
-
Fundamental problems in visco-plasticity
-
Academic Press, New York
-
Perzyna P. Fundamental problems in visco-plasticity. Recent Advances in Applied Mechanics (1966), Academic Press, New York
-
(1966)
Recent Advances in Applied Mechanics
-
-
Perzyna, P.1
-
32
-
-
0022219728
-
On constitutive modelling of dissipative solids for plastic flow, instability and fracture
-
Sawczuk A., and Bianchi G. (Eds), Elsevier Applied Science Publishers
-
Perzyna P. On constitutive modelling of dissipative solids for plastic flow, instability and fracture. In: Sawczuk A., and Bianchi G. (Eds). Plasticity Today: Modelling, Methods and Applications (1985), Elsevier Applied Science Publishers 657-679
-
(1985)
Plasticity Today: Modelling, Methods and Applications
, pp. 657-679
-
-
Perzyna, P.1
-
34
-
-
1642407142
-
Reflow profile study of the Sn-Ag-Cu solder
-
Salam B., Virseda C., Da H., Ekere N., and Durairaj R. Reflow profile study of the Sn-Ag-Cu solder. Soldering & Surface Mount Technology 16 1 (2004) 27-34
-
(2004)
Soldering & Surface Mount Technology
, vol.16
, Issue.1
, pp. 27-34
-
-
Salam, B.1
Virseda, C.2
Da, H.3
Ekere, N.4
Durairaj, R.5
-
35
-
-
0028464718
-
Dispersive properties of gradient-dependent and rate-dependent media
-
Sluys L., and De Borst R. Dispersive properties of gradient-dependent and rate-dependent media. Mechanics of Materials 18 (1994) 131-149
-
(1994)
Mechanics of Materials
, vol.18
, pp. 131-149
-
-
Sluys, L.1
De Borst, R.2
-
39
-
-
2942575990
-
Thermal cycling reliability of lead-free chip resistor solder joints
-
Suhling J., Gale H., Wayne Johnson R., Nokibul Islam M., and Shete T. Thermal cycling reliability of lead-free chip resistor solder joints. Soldering & Surface Mount Technology 16 2 (2004) 77-87
-
(2004)
Soldering & Surface Mount Technology
, vol.16
, Issue.2
, pp. 77-87
-
-
Suhling, J.1
Gale, H.2
Wayne Johnson, R.3
Nokibul Islam, M.4
Shete, T.5
-
41
-
-
11344291942
-
Grain-boundary character and grain growth in bulk tin and bulk lead-free solder alloys
-
Telang A., Bieler T., and Lucas J. Grain-boundary character and grain growth in bulk tin and bulk lead-free solder alloys. Journal of Electronic Materials 33 12 (2004) 1412-1423
-
(2004)
Journal of Electronic Materials
, vol.33
, Issue.12
, pp. 1412-1423
-
-
Telang, A.1
Bieler, T.2
Lucas, J.3
-
44
-
-
1142300599
-
Thermodynamic framework for coupling of non-local viscoplasticity and non-local anisotropic viscodamage for dynamic localization problems using gradient theory
-
Voyiadjis G., Abu Al-Rub R., and Palazotto A. Thermodynamic framework for coupling of non-local viscoplasticity and non-local anisotropic viscodamage for dynamic localization problems using gradient theory. International Journal of Plasticity 20 (2004) 981-1038
-
(2004)
International Journal of Plasticity
, vol.20
, pp. 981-1038
-
-
Voyiadjis, G.1
Abu Al-Rub, R.2
Palazotto, A.3
-
45
-
-
0034325866
-
Formulation of an implicit algorithm for finite deformation viscoplasticity
-
Wang W., and Sluys L. Formulation of an implicit algorithm for finite deformation viscoplasticity. International Journal of Solids and Structures 37 (2000) 7329-7348
-
(2000)
International Journal of Solids and Structures
, vol.37
, pp. 7329-7348
-
-
Wang, W.1
Sluys, L.2
-
47
-
-
12344267918
-
Ageing effects on microstructure and tensile property of Sn3.9Ag0.6Cu solder alloy
-
Xiao Q., Bailey H., and Armstrong W. Ageing effects on microstructure and tensile property of Sn3.9Ag0.6Cu solder alloy. Journal of Electronic Materials 126 2 (2004) 208-212
-
(2004)
Journal of Electronic Materials
, vol.126
, Issue.2
, pp. 208-212
-
-
Xiao, Q.1
Bailey, H.2
Armstrong, W.3
-
48
-
-
17844391839
-
EBSD characterization of cavitation during superplastic deformation of Al-Li alloy
-
Xun Y., Tan M., and Liew K. EBSD characterization of cavitation during superplastic deformation of Al-Li alloy. Journal of Materials Processing Technology (2005) 429-434
-
(2005)
Journal of Materials Processing Technology
, pp. 429-434
-
-
Xun, Y.1
Tan, M.2
Liew, K.3
-
49
-
-
3042758716
-
Improvement on the microstructure stability, mechanical and wetting properties of Sn-Ag-Cu lead-free solder with the addition of rare earth elements
-
Yu D., Zhao J., and Wang L. Improvement on the microstructure stability, mechanical and wetting properties of Sn-Ag-Cu lead-free solder with the addition of rare earth elements. Journal of Alloys and Compounds 376 1-2 (2004) 170-175
-
(2004)
Journal of Alloys and Compounds
, vol.376
, Issue.1-2
, pp. 170-175
-
-
Yu, D.1
Zhao, J.2
Wang, L.3
|