Challenges for capillary self-assembly of microsystems

IEEE Transactions on Components, Packaging and Manufacturing Technology

Volumn 1, Issue 1, 2011, Pages 133-149

  Mastrangeli, M ^a,b,c   Ruythooren, W ^a,d   Celis, J ^b   Van Hoof, C ^a,e  

^a IMEC   (Belgium)

^b UNIVERSITY OF LEUVEN   (Belgium)

^c EPFL   (Switzerland)

^d Photovoltec   (Belgium)

^e Katholieke Universiteit Leuven   (Belgium)

Author keywords

Capillarity; failure modes; packaging; self assembly; system integration

Indexed keywords

ASSEMBLY TECHNIQUES; EXPERIMENTAL DATUM; INNOVATIVE TECHNIQUES; INTEGRATION AND PACKAGING; INTEGRATION TECHNOLOGIES; SELF-ASSEMBLY METHOD; SELF-ASSEMBLY TECHNIQUE; SYSTEM INTEGRATION;

CAPILLARITY; FAILURE MODES; MICROSYSTEMS; PACKAGING;

SELF ASSEMBLY;

EID: 80052208213     PISSN: 21563950     EISSN: None     Source Type: Journal    
DOI: 10.1109/TCPMT.2010.2100970     Document Type: Article

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