Resin self-alignment processes for self-assembly systems

Journal of Electronic Packaging

Volumn 127, Issue 1, 2005, Pages 18-24

  Kim, Jong Min ^a,b   Yasuda, Kiyokazu ^a   Fujimoto, Kozo ^a  

^a OSAKA UNIVERSITY   (Japan)

^b Chung Ang University   (South Korea)

Author keywords

[No Author keywords available]

Indexed keywords

CHLOROFLUOROCARBONS; DAMPING; MATHEMATICAL MODELS; OSCILLATORS (ELECTRONIC); PARAMETER ESTIMATION; SELF ASSEMBLY; SOLDERING; SURFACE TENSION;

LIQUID JOINTS; MICROELECTROMECHANICAL SYSTEMS (MEMS); POLYMERIC ELECTRONIC PACKAGING (PEP); RESIN SELF-ALIGNMENT PROCESSES;

RESINS;

EID: 18744371116     PISSN: 10437398     EISSN: None     Source Type: Journal    
DOI: 10.1115/1.1846061     Document Type: Article

References (23)

1. Romig, Jr, A. D., Dugger, M. T., and McWhorter, P. J., 2003, "Materials Issues in Microelectromechanical Devices: Science, Engineering, Manufacturability and Reliability," Acta Mater., 51, pp. 5837-5866.
2. Oh, K. W., Ahn, C. H., and Roenker, K. P., 1999, "Flip-Chip Packaging Using Micro-machined Conductive Polymer Bumps and Alignment Pedestals for MOEMS," IEEE J. Sel. Top. Quantum Electron., 5(1), pp. 119-126.
3. Prather, D. W., Venkataraman, S., Lecompte, M., Kiamilev, F., Mail, J. N., and Simonis, G. J., 2001, "Optoelectronic Multichip Module Integration for Chip Level Optical Interconnects," IEEE Photonics Technol. Lett., 13(10), pp. 1112-1114.
4. Holm, J., Åhlfeldt, H., Svensson, M., and Vieider, C., 2000, "Through-Etched Silicon Carriers for Passive Alignment of Optical Fibers to Surface-Active Optoelectronic Components," Sens. Actuators, A, 82(1-3), pp. 245-248.
5. Linderman, R. J., and Bright, V. M., 2001, "Nanometer Precision Positioning Robots Utilizing Optimized Scratch Drive Actuators," Sens. Actuators, A, 91(3), pp. 292-300.
6. Srinivasan, U., Liepmann, D., and Howe, R. T., 2001, "Microstructure to Substrate Self-Assembly Using Capillary Forces," J. Microelectromech. Syst., 10(1), pp. 17-24.
7. Martin, B. R., Furnange, D. C., Jackson, T. N., Mallouk, T. E., and Mayer, T. S., 2001, "Self-Alignment of Patterned Wafers Using Capillary Forces at a Water-Air Interface," Adv. Funct. Mater., 11(5), pp. 381-386.
8. Sato, K., Ito, K., Hata, S., and Shimokohbe, A., 2003, "Self-Alignment of Microparts Using Liquid Surface Tension-Behavior of Micropart and Alignment Characteristics," Precis. Eng., 27(1), pp. 42-50.
9. Wale, M. J., and Edge, C., 1990, "Self-Aligned Flip-Chip Assembly of Photonic Devices with Electrical and Optical Connections," IEEE Trans. Compon., Hybrids, Manuf. Technol., 13(4), pp. 780-786.
10. Haugsjaa, P. O., 1997, "Passive Alignment for Optoelectronic Components," Adv. Electron. Packag. ASME, EEP-Vol., 19-1, pp. 753-758.
11. Miller, L. F., 1969, "Controlled Collapse Reflow Chip Joining," IBM J. Res. Dev., 13, pp. 239-250.
12. Park, C. B., Hong, S. M., Jung, J. P., Kang, C. S., and Shin, Y. E., 2001, "A Study on the Fluxless Soldering of Si-Wafer/Glass Substrate Using Sn-3.5mass%Ag and Sn-37mass%Pb Solder," Mater. Trans., JIM, 42(5), pp. 820-824.
13. Harris, P. G., 1995, "Conductive Adhesives: A Critical Review of Progress to Date," Soldering Surf. Mount Technol., 20, pp. 19-21.
14. Moon, K.-S., Wu, J., and Wong, C. P., 2001, "Study on Self-Alignment Capability of Electrically Conductive Adhesives (EGAs) for Flip-Chip Application," International Symposium on Advanced Packaging Materials, pp. 341-346.
15. Heinrich, S. M., Schaefer, M., Schroeder, S. A., and Lee, P. S., 1996, "Prediction of Solder Joint Geometries in Array-Type Interconnects," ASME J. Electron Packag., 118(3), pp. 114-121.
16. Chiang, K.-N., and Chen, W.-L., 1998, "Electronic Packaging Reflow Shape Prediction for the Solder Mask Defined Ball Grid Array," ASME J. Electron. Packag., 120(2), pp. 175-178.
17. Brakke, K. A., 1999, Surface Evolver Manual, Version 2.14. Mathematics Department Susquehanna Univ., Selinsgrove, PA.
18. Veen, N. V., 1999, "Analytical Derivation of the Self-Alignment Motion of Flip Chip Soldered Components," ASME J. Electron. Packag., 121(2), pp. 116-121.
19. Manko, H. H., 1992, Solders and Soldering, 3rd ed., McGraw-Hill, New York, Chap. 3.
20. Su, B., Gershovich, M., and Lee, Y. C., 1997, "Gas Flow Effects on Precision Solder Self-Alignment," IEEE Trans. Compon. Packag. Manuf. Technol., Part C, 20(4), pp. 305-311.
21. Kim, J. M., Shin, Y. E., and Fujimoto, K., 2003, "Effect of Viscosity of Liquid Resin on Resin Self-Alignment Capability," Mater. Sci. Forum, 439, pp. 12-17.
22. Landry, M., Patra, S. K., and Lee, Y. C., 1991, "Experiment and Modeling of the Self-Alignment Mechanism in Flip-Chip Soldering," Manufac. Processes and Materials Challenges in Microelec. Packag. ASME, AMD-Vol., 131/EEP-Vol., 1, pp. 49-56.
23. Rao, S. S., 1995, Mechanical Vibrations, 3rd ed., Addison-Wesley, New York, Chap. 2.