Lateral capillary forces of cylindrical fluid menisci: A comprehensive quasi-static study

Journal of Micromechanics and Microengineering

Volumn 20, Issue 7, 2010, Pages

  Mastrangeli, M ^a,b   Valsamis, J B ^c   Van Hoof, C ^a,b   Celis, J P ^b   Lambert, P ^c,d  

^a IMEC   (Belgium)

^b UNIVERSITY OF LEUVEN   (Belgium)

^c UNIVERSITÉ LIBRE DE BRUXELLES   (Belgium)

^d FEMTO ST INSTITUTE   (France)

Author keywords

[No Author keywords available]

Indexed keywords

ADVANCING CONTACT ANGLE; ANALYTICAL MODEL; CONSTRAINED FLUIDS; EXPERIMENTAL APPARATUS; EXPERIMENTAL DATA; EXPERIMENTAL INVESTIGATIONS; FINITE ELEMENT; LATERAL CAPILLARY FORCES; MENISCUS FORCE; NUMERICAL MODELING; QUASI-STATIC; SELF ALIGNMENT;

CONTACT ANGLE; FINITE ELEMENT METHOD; MATHEMATICAL MODELS; MICROSYSTEMS;

FLUIDS;

EID: 77955409443     PISSN: 09601317     EISSN: 13616439     Source Type: Journal    
DOI: 10.1088/0960-1317/20/7/075041     Document Type: Article

References (56)

1. Adamson A W 1990 Physical Chemistry of Surfaces (New York: Wiley)
2. de Gennes P-G,Brochard-Wyart F and Quere D 2004 Capillarity and Wetting Phenomena: Drops Bubbles Pearls Waves (Berlin: Springer)
3. Israelachvili J.1994 Intermolecular and Surface Forces (New York: Academic)
4. Berge B and Peseux J.2000 Variable focal lens controlled by an external voltage: an application of electrowetting Eur. Phys. J. E 3 159-63
5. De Volder M,Peirs J. Reynaerts D,Coosemans J. Puers R,Smal O and Raucent B 2005 A novel hydraulic microactuator sealed by surface tension Sensors Actuators A 123-124 547-54
6. Lambert P 2007 Capillary Forces in Microassembly (Berlin: Springer)
7. Wassink R J.K 2005 Soldering in Electronics (Port Erin: Electrochemical Publications)
8. Gad el Hak M (ed) 1998 The MEMS Handbook (Boca Raton FL: CRC Press)
9. Boncheva M and Whitesides G M 2005 Making things by self-assembly MRS Bull. 30 736-42
10. Goodman L S 1969 Geometrical optimization of controlled collapse interconnections IBM J. Res. Dev. 13 251-65
11. Kallmayer C,Oppermann H,Engelmann G,Zakel E and Reichl H 1996 Self-aligning flip-chip assembly using eutectic gold/tin solder in different atmospheres IEEE Int. Electronics Manufacturing Technology Symp. pp 18-25
12. Humpston G 1997 Flip chip solder bonding for microsystems IEE Coll. on Assembly and Connections in Microsystem
13. Tan Q and Lee Y C 1996 Soldering technology for optoelectronic packaging IEEE Electronic Components and Technology Conf. pp 26-36
14. Syms R R A Yeatman E M Bright V M and Whitesides G M 2003 Surface-tension powered self-assembly of microstructures the state of the art IEEE J. Microelectromech. Syst. 12 387-417
15. Guo X,Lic H,Ahn B Y,Duoss E B,Hsia K J. Lewis J.A and Nuzzo R G 2009 Two- and three-dimensional folding of thin film single-crystalline silicon for photovoltaic power applications Proc. Natl Acad. Sci. USA 106 20149-54
16. Mastrangeli M,Abbasi S,Varel C,Hoof C van,Celis J-P and Bohringer K F 2009 Self-assembly from milli- to nanoscale: methods and applications J. Micromech. Microeng. 19 083001
17. Terfort A,Bowden N and Whitesides G M 1997 Three-dimensional self-assembly of millimetre-scale omponents Nature 386 162-4
18. Terfort A and Whitesides G M 1998 Self-assembly of an operating electrical circuit based on shape complementarity and the hydrophobic effect Adv. Mater. 10 470-3
19. Boncheva M,Bruzewicz D A and Whitesides G M 2003 Millimeter-scale self-assembly and its applications Pure Appl. Chem. 75 621-30
20. Srinivasan U Liepmann D and Howe R T 2001 Microstructure to substrate self-assembly using capillary forces IEEE J. Microelectromech. Syst. 10 17-24 (Pubitemid 32287836)
21. Scott K L,Hirano T,Yang H,Singh H,Howe R T and Niknejadk A N 2004 High-performance inductors using capillary based fluidic self-assembly IEEE J. Microelectromech. Syst. 13 300-9
22. Xiong X,Hanein Y,Fang J. Wang Y,Wang W,Schwartz D T and Bohringer K F 2003 Controlled multibatch self-assembly of microdevices IEEE J. Microelectromech. Syst. 12 117-27
23. Fukushima T,Yamada Y,Kikuchi H,Tanaka T and Koyanagi M 2007 Self-assembly process for chip-to-wafer three-dimensional integration IEEE Electronic Components and Technology Conf. pp 836-841
24. Fukushima T,Kikuchi H,Yamada Y,Konno T,Liang J. Sasaki K,Inamura K,Tanaka T and Koyanagi M 2007 New three-dimensional integration technology based on rreconfigured wafer-on-wafer bonding technique IEEE Int. Electronic Device Meeting pp 985-8
25. Stauth S A and Parviz B A 2006 Self-assembled single-crystal silicon circuits on plastic Proc. Natl Acad. Sci. USA 103 13922-7
26. Morris C J.and Parviz B A 2008 Micro-scale metal contacts for capillary force-driven self-assembly J. Micromech. Microeng. 18 015022 (10pp)
27. Zheng W and Jacobs H O 2006 Self-assembly process to integrate and interconnect semiconductor dies on surfaces with single-angular orientation and contact-pad registration Adv. Mater. 18 1387-92
28. Chung J. Zheng W,Hatch T J.and Jacobs H O 2006 Programmable reconfigurable self-assembly: parallel heterogeneous integration of chip-scale components on planar and nonplanar surfaces IEEE J. Microelectromech. Syst. 15 457-64
29. Saeedi E,Abbasi S,Bohringer K F and Parviz B A 2006 Molten-alloy driven self-assembly for nano and micro scale system integration Fluid Dyn. Mater. Process. 2 221-45
30. Mastrangeli M,Ruythooren W,Van Hoof C and Celis J-P 2009 Conformal dip-coating of patterned surfaces for capillary die-to-substrate self-assembly J. Micromech. Microeng. 19 045015
31. Takei A,Matsumoto K and Shimoyama I 2010 Capillary torque caused by a liquid droplet sandwiched between two plates Langmuir 26 2497-504
32. Patra S K and Lee Y C 1991 Quasi-static modeling of the self-alignment mechanism in flip-chip soldering: Part 1. Single solder joint J. Electron. Packag. 113 337-42
33. Patra S K and Lee Y C 1991 Modeling of self-alignment mechanism in flip-chip soldering: Part II. Multichip solder joints Proc. Electronic Components and Technology Conf. pp 783-8
34. Yost B,McGroarty J. Borgesen P and Li C-Y 1993 Shape of a nonaxisymmetric liquid solder drop constrained by parallel plates IEEE Trans. Compon. Hybrids Manuf. Technol. 16 523-6
35. Lin W, Patra S K and Lee Y C 1995 Design of solder joints for self-aligned optoelectronics assembly IEEE Trans. Compon. Packag. Manuf. Technol. B 18 543-51
36. Lieneman J. Greiner A ,Korvink J.G,Xiong X,Hanein Y and Bohringer K F 2003 Modelling simulation and experiment of a promising new packaging technology parallel fluidic self-assembly of microdevices Sensors Update 13 3-43
37. Bohringer K F,Srinivasan U and Howe R T 2001 Modelling of capillary forces and binding sites for fluidic self-assembly EEE Int. Conf. on MEMS pp 369-74
38. Liang S-H,Xiong X and Bohringer K F 2004 Toward optimal designs for self-alignment in surface tension driven micro-assembly IEEE Int. Conf. on MEMS pp 9-12
39. Xiong X,Liang S-H and Bohringer K F 2004 Geometric binding site design for surface-tension driven self-assembly Proc. IEEE Int. Conf. on Robotics and Automation pp 1141-8
40. Van Veen N 1999 Analytical derivation of the self-alignment motion of flip-chip soldered components Trans. ASME 121 116-21
41. Mastrangeli M 2010 Enabling capillary self-assembly for microsystem integration PhD Thesis Arenberg Doctoral School Katholieke Universiteit Leuven
42. Sato K Ito K,Hata S and Shimokohbe A 2003 Self-alignment of microparts using liquid surface tension: behaviour of micropart and alignment characteristics Precision Eng. 27 42-50
43. Sato K,Lee K,Nishimura M and Okutsu K 2007 Self-alignment and bonding of microparts using adhesive droplets Int. J. Precis. Eng. Manuf. 8 75-9
44. Bernstein R W,Zhang X,Zappe S,Fish M,Scott M and Solgaard O 2004 Characterization of fluidic microassembly for immobilization and positioning ofdrosophila embryos in 2-d arrays Sensors Actuators A 114 191-6
45. Lin C,Tseng F and Chieng C-C 2008 Studies on size and lubricant effects for fluidic self-assembly of microparts on patterned substrates using capillary effect J. Electron. Packag. 130 021005-1
46. Cooper C D and Alley F C 1994 Air Pollution Control: A Design Approach (Chicago IL: Waveland)
47. Zhang X,Chen C-C,Bernstein R W,Zappe S,Scott M P and Solgaard O 2005 Microoptical characterization and modeling of positioning forces on drosophila embryos self-assembled in two-dimensional arrays IEEE J. Microelectromech. Syst. 14 1187-97
48. Clasen C,Gearing B P and McKinley G H 2006 The flexure-based microgap rheometer (fmr) J. Rheol. 50 883-905
49. Lambert P,Mastrangeli M,Valsamis J-B and Degrez G 2010 Spectral analysis and experimental study of lateral capillarydynamics for flip-chip applications Microfluid. Nanofluid. DOI:10.1007/s10404-010-0595-2
50. Oliver J.F,Huh C and Mason S G 1977 Resistance to spreading of liquids by sharp edges J. Colloid Interface Sci. 59 568-81
51. Brakke K A 1992 The surface evolver Exp. Math. 1 141-65
52. Martino P M,Freedman G M,Racz L M and Szekely J.1994 Predicting solder joint shape by computer modeling Proc. Electronic Components and Technology Conf. pp 1071-8
53. Weatherburn C E 1955 Differential Geometry of Three Dimensions (Cambridge: Cambridge University Press)
54. Thomson W T and Dahleh M D 1998 Theory of Vibration with Applications (Englewood Cliffs NJ: Prentice-Hall)
55. Sariola V,Zhou Q and Koivo H N 2008 Hybrid microhandling: a unified view of robotic handling and self-assembly J. Micro-Nano Mech. 4 5-16
56. Henein S 2000 Conception des structures articulées á guidages flexibles de haute précision PhD Thesis Ecole Polytechnique Federale de Lousanne