Programmable batch assembly of microparts with 100% yield

TRANSDUCERS 2009 - 15th International Conference on Solid-State Sensors, Actuators and Microsystems

Volumn , Issue , 2009, Pages 829-832

  Hoo, J ^a   Baskaran, R ^a,b   Bohringer K F ^a  

^a UNIVERSITY OF WASHINGTON   (United States)

^b INTEL CORPORATION   (United States)

Author keywords

Heterogeneous integration; Packaging; Self assembly

Indexed keywords

BATCH ASSEMBLY; CHEMICAL KINETICS; DELIVERY MECHANISM; FEEDBACK CONFIGURATION; HETEROGENEOUS INTEGRATION; MICRO PART; NOVEL METHODS; OPEN LOOPS; RECEPTOR SITES;

ACTUATORS; MICROSYSTEMS; PIEZOELECTRIC TRANSDUCERS; SELF ASSEMBLY;

SOLID-STATE SENSORS;

EID: 71449087794     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/SENSOR.2009.5285762     Document Type: Conference Paper

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