Self-assembly process to integrate and connect semiconductor dies on surfaces with single-angular orientation and contact-pad registration

Advanced Materials

Volumn 18, Issue 11, 2006, Pages 1387-1392

  Zheng, Wei ^a   Jacobs, Heiko O ^a  

^a University of Minnesota   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COATINGS; DEFECTS; DIES; SEMICONDUCTOR MATERIALS;

CONTACT-PAD REGISTRATION; MICROMETER-SIZED COMPONENTS; SELF-ASSEMBLY PROCESSES; SINGLE-ANGULAR ORIENTATION;

SELF ASSEMBLY;

EID: 33745175893     PISSN: 09359648     EISSN: None     Source Type: Journal    
DOI: 10.1002/adma.200502026     Document Type: Article

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