Self-assembly of micro-parts using electrostatic forces and surface tension

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2009, Pages 1517-1524

  Dalin, Johan ^a   Wilde, Jürgen ^a  

^a UNIVERSITY OF FREIBURG   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

ADHESIVE PADS; ALIGNMENT STRUCTURE; ELECTRICALLY CONDUCTIVE; ELECTROSTATIC ATTRACTIONS; FLUIDIC MEDIUM; FUTURE PERSPECTIVES; GRAVITATIONAL FORCES; MICRO PART; PHYSICAL PRINCIPLES; PROCESS FLOWS; SELF ALIGNMENT; SELF-ALIGNED; SMALL AREA; STATE-OF-THE-ART TECHNOLOGY; STRUCTURED PATTERNS; SURFACE AREA; THIRD PARTIES;

ALIGNMENT; BINDING ENERGY; BINDING SITES; CAPILLARITY; ELECTROSTATIC DEVICES; EXPERIMENTS; GRAVITATION; MACHINERY; SELF ASSEMBLY; SURFACE CHEMISTRY; SURFACE PROPERTIES; SURFACE TENSION; SURFACE WAVES; TECHNOLOGY; WETTING;

ELECTROSTATIC FORCE;

EID: 70349678236     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ECTC.2009.5074214     Document Type: Conference Paper

References (14)

1. Uthara Srinivasan et.al., "Fluidic self-assembly of micromirrors onto microactuators using capillary forces", IEEE Journal on selected topics in quantum electronics, Vol. 8, No. 1, Januar/Februar 2002, pp. 4-11.
2. Uthara Srinivasan et.al., "Microstructure to substrate selfassembly using capillary forces", IEEE journal of microelec.-mech. systems, Vol.10, No. 1, März 2001, pp. 17-24.
3. Clark T.D. et.al., "Template-directed self-assembly of 10- micron-sized hexagonal plates", Journal of the American Chemical Soc. 124, 2002, pp. 5419-5426.
4. Clark T.D., et al., "Self-assembly of 10 um-sized objects into ordered three-dimensional arrays", Journal of the American Chemical Society 123, 2001, pp. 7677-7682.
5. K. Bohringer et.al., "Parallel microassembly with electrostatic force fields", In Proc. IEEE Int. Conf. on Robotics and Automation (ICRA), Leuven, Belgium, Mai, 1998.
6. Christopher D. Nordquist et.al., "An electro-fluidic assembly technique for integration of III-V devices onto silicon", IEEE International Symposium on Compound Semiconductors, 2000, pp. 137-142.
7. Theresa S. Mayer et.al., "Electro-fluidic assembly process for integration of electronic devices onto a substrate", United States Patent 6 687 987 B2, 10 Februar, 2004.
8. Karl F. Böhringer, "Engineered self-sssembly from nano to milli scales", 4M Network of Exc. Conference: Multi-Material Micro Manufacture, Sept. 2008. pp. 28-31.
9. Veikko Sariola et.al, "Hybrid microhandling: a unified view of robotic handling and self-assembly", Journal Micro-Nano Mech. 4, 2008, pp. 5-16.
10. Graeme Maxwell, "Low-cost hybrid photonic integrated circuits using passive alignment techniques", LEOS 06, Oct. 2006, pp. 98-99.
11. Louay Eldada, "Hybrid integrated photonic components based on a polymer platform", Photonics packaging and integration. Con. No.3, vol.4997, 2003, pp. 88-102.
12. Loesch, Kurt H. et.al., "Integrated thermo-optic switches in silica/polymer waveguide technology", Proc. SPIE Materials and Devices for Photonic Circuits II, vol.4453, pp. 52-60.
13. Sarma, S et.al., "Radio frequency identification and the electronic product code", IEEE journal Micro., vol. 21, Issue 6, November/December 2001, pp. 50-54. 14.
14. J. Lienemann, "Modeling and simulation of the fluidic controlled self-assembly of micro parts", Final thesis M. Sc., IMTEK, Albert-Ludwigs-Universität Freiburg, 2002.