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Electrochimica Acta

Volumn 56, Issue 13, 2011, Pages 4724-4734

Classification of suppressor additives based on synergistic and antagonistic ensemble effects

(8) Broekmann, P a,b Fluegel, A a Emnet, C a Arnold, M a Roeger Goepfert, C a Wagner, A a Hai, N T M b Mayer, D a

a BASF SE (Germany)

b UNIVERSITY OF BERN (Switzerland)

Author keywords

Additive; Copper Damascene process; Electroplating; STM

Indexed keywords

ADDITIVE ADSORPTION; ADSORPTION BEHAVIOR; ADSORPTION SITE; ANTAGONISTIC INTERACTIONS; ATOMIC SCALE; BARRIER PROPERTIES; CHLORIDE MATRIX; COMPOSITIONAL CHANGES; COPPER DAMASCENE PROCESS; COPPER ELECTROPLATING; COPPER SUBSTRATES; COPPER SURFACE; CUPRIC IONS; DAMASCENE PROCESSING; DEPOSITION CONDITIONS; ELECTRODE SURFACES; ENSEMBLE EFFECT; GROWTH MODES; IN-SITU; INTER-DIFFUSION; METALLIC COPPER; MODEL SUBSTRATES; PLATING ADDITIVES; POTENTIAL TRANSIENT MEASUREMENT; SINGLE-CRYSTALLINE; STM; SULFONIC ACID;

ADSORPTION; CHEMISORPTION; CHLORINE; CHLORINE COMPOUNDS; COPPER; COPPER METALLURGY; DIFFUSION BARRIERS; IODINE; NEGATIVE IONS; SCANNING TUNNELING MICROSCOPY; SUBSTRATES; TRANSIENT ANALYSIS;

ADDITIVES;

EID: 79955867195 PISSN: 00134686 EISSN: None Source Type: Journal
DOI: 10.1016/j.electacta.2011.03.015 Document Type: Article

Times cited : (151)

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