Inhibition due to the interaction of polyethylene glycol, chloride, and copper in plating baths: A surface-enhanced Raman study

Journal of Physical Chemistry B

Volumn 107, Issue 35, 2003, Pages 9415-9423

  Feng, Z Vivian ^a   Li, Xiao ^a   Gewirth, Andrew A ^a  

^a UNIVERSITY OF ILLINOIS AT URBANA CHAMPAIGN   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ADSORPTION; CHLORINE COMPOUNDS; COPPER; MOLECULAR STRUCTURE; MOLECULAR VIBRATIONS; NUMERICAL METHODS; POLYETHYLENE GLYCOLS; RAMAN SPECTROSCOPY; SURFACE TREATMENT; SURFACES;

CHLORIDE; COPPER DEPOSITION; PLATING BATHS;

ELECTROPLATING;

EID: 0141630715     PISSN: 15206106     EISSN: None     Source Type: Journal    
DOI: 10.1021/jp034875m     Document Type: Article

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