Chemical mechanism of suppression of copper electrodeposition by poly(ethylene glycol)

Journal of the Electrochemical Society

Volumn 152, Issue 5, 2005, Pages

  Hebert, Kurt R ^a   Adhikari, Saikat ^a   Houser, Jerrod E ^a  

^a Iowa State University of Science and Technology   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COPPER; CRYSTAL DEFECTS; ELECTROLYTES; MOLECULAR WEIGHT; POLYETHYLENE GLYCOLS; POSITIVE IONS; RAMAN SPECTROSCOPY; SOLUTIONS;

BLOCKING LAYERS; COPPER PLATING CELLS; LIGANDS; REACTANTS;

ELECTRODEPOSITION;

EID: 20344387208     PISSN: 00134651     EISSN: None     Source Type: Journal    
DOI: 10.1149/1.1882112     Document Type: Article

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