Copper electroplating approaches for 16nm technology

Solid State Technology

Volumn 53, Issue 5, 2010, Pages 14-16

  Reid, Jonathan ^a   McKerrow, Andrew ^a   Varadarajan, Sesha ^a   Kozlowski, Greg ^a  

^a NOVELLUS SYSTEMS INC   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COPPER ELECTROPLATING; COPPER SEED; ELECTRODEPOSITION PROCESS; FEATURE DIMENSIONS; HIGH NUCLEATION DENSITY; MEMORY STRUCTURE; PLATING PROCESS; SEED LAYER;

COPPER;

EID: 77953276801     PISSN: 0038111X     EISSN: None     Source Type: Trade Journal    
DOI: None     Document Type: Article

References (13)

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