Electrochemical materials and processes in Si integrated circuit technology

Electrochimica Acta

Volumn 52, Issue 8 SPEC. ISS., 2007, Pages 2891-2897

  Dubin, V M ^a   Akolkar, R ^a   Cheng, C C ^a   Chebiam, R ^a   Fajardo, A ^a   Gstrein, F ^a  

^a INTEL CORPORATION   (United States)

Author keywords

Carbon nanotubes; Cobalt; Copper; Dielectrophoresis; Electroplating

Indexed keywords

CARBON NANOTUBES; COBALT; COPPER; ELECTROCHEMISTRY; ELECTROLESS PLATING; ELECTROMIGRATION; ELECTROPHORESIS; ELECTROPLATING; OPTICAL INTERCONNECTS; SEMICONDUCTING SILICON;

DIELECTROPHORESIS; ELECTROCHEMICAL MATERIALS; ELECTROLESS COBALT CAPPING LAYER; ON-CHIP COPPER INTERCONNECTS;

INTEGRATED CIRCUITS;

EID: 33846476110     PISSN: 00134686     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.electacta.2006.08.072     Document Type: Article

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